DS-CPC1777-R08

www.ixysic.com

1

Characteristics

Features

On-Resistance

Heat Sink Applications

Applications

Approvals

Pin Configuration

Description

IXYS Integrated Circuits Division and IXYS have

combined to bring OptoMOS® technology, reliability

and compact size to a new family of High Power Solid

State Relays. As part of this new family, the CPC1777

single-pole normally open (1-Form-A) DC Solid State

Relay employs optically coupled MOSFET technology

The optically coupled outputs, that use patented

OptoMOS architecture, are controlled by a highly

efficient infrared LED. The combination of low

on-resistance and high load current handling

capability makes this relay suitable for a variety of high

performance DC switching applications.

The unique i4-PAC package pioneered by IXYS

enables solid state relays to achieve the highest load

current and power ratings. This package features an

IXYS unique process where the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

substrate instead of the usual copper leadframe. The

DCB ceramic, the same substrate used in high power

very low junction-to-case thermal resistance

(0.35°C/W).

Ordering Information

Switching Characteristics

Parameter

Rating

Units

Blocking Voltage

600

With 5°C/W Heat Sink

4.6

No Heat Sink

1.5

On-Resistance (max)

0.5



Thermal Resistance,

Junction-to-Case,



JC

0.35

°C/W

12

3

4

+-

-

+

Part

Description

CPC1777J

i4-PAC Package (25 per tube)

Form-A

I

F

I

LOAD

10%

90%

t

on

t

off

CPC1777

600V Single-Pole, Normally Open

DC-Only Power Relay