TDA8922 datasheet(21/36 Pages) PHILIPS

21 / 36 page

2003 Mar 20

Philips Semiconductors

Objective speciﬁcation

× 25 W class-D power ampliﬁer

TDA8922

16.11 Bill of materials for reference design

Table 1

Single-chip class-D audio ampliﬁer printed-circuit board (PCB version 4; 1-2002) for TDA8922TH

(see Figs 10 and 11).

BOM ITEM

QUANTITY

REFERENCE

PART

DESCRIPTION

TDA8922TH

Philips Semiconductors B.V.

in1 and in2

cinch inputs

Farnell 152-396

out1 and out2

output connector

Augat 5KEV-02

VDD, GND and VSS

supply connector

Augat 5KEV-03

L6 and L5

µH

EP13 or 16RHBP

L1, L2, L3 and L4

BEAD

Murata BL01RN1-A62

PCB switch

Knitter ATE1E M-O-M

5V6

BZX 79C5V6 DO-35

C1 and C2

470

µF; 35 V

Panasonic M series

ECA1VM471

C3, C4 and C5

µF; 63 V

Panasonic NHG series

ECA1JHG470

C16, C17, C18, C19, C26 and

C27

470 nF; 63 V

MKT EPCOS B32529-C474-K

C8, C9, C11, C14, C28, C29,

C32, C35 and C38

220 nF; 63 V

SMD 1206

C6, C7, C10, C12, C13, C15,

C34, C36, C37 and C39

100 nF; 50 V

SMD 0805

C20 and C21

330 pF; 50 V

SMD 0805

C22, C23, C30 and C31

15 nF; 50 V

SMD 0805

C24, C25

560 pF; 100 V

SMD 0805

C33

47 pF; 25V

SMD 0805

R4 and R3

39 k

Ω; 0.1 W

SMD 0805

30 k

Ω; 0.1 W

SMD 1206

10 k

Ω; 0.1 W; optional SMD 0805

9.1 k

Ω; 0.1 W; optional SMD 0805

R6, R7, R8 and R9

5.6 k

Ω; 0.1 W

SMD 0805

R13 and R12

Ω; 1 W

SMD 2512

R10 and R11

4.7

Ω; 0.25 W

SMD 1206

J1 and J2

solder dot jumpers for ground reference in case of hum

(60 Hz noise)

J3 and J4

wire jumpers for BTL application

heatsink

30 mm SK400; OK for maximum music dissipation;

1/8 Prated (2

× 75 W/8) in 2 × 4 Ω at T

amb =70 °C

printed-circuit board material

1.6 mm thick epoxy FR4 material, double sided 35

µm

copper; clearances 300

µm; minimum copper track

400

µm

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