No.849C/May.2015

Conductive Polymer Hybrid

Aluminum Electrolytic Capacitors

Please contact us for mass production schedule.

Specifications in this bulletin are subject to change without notice.

NIPPON CHEMI-CON CORPORATION

1755

2

HXC

Series

◆ STANDARD RATINGS

WV

Cap

(μF)

Size code

ESR

(mΩ max/20℃ , 100kHz)

Rated ripple current

(mArms/125℃ , 100kHz)

Part No.

16

270

HA0

22

1,700

HHXC160ARA271MHA0G

470

JA0

18

2,100

HHXC160ARA471MJA0G

25

220

HA0

27

1,600

HHXC250ARA221MHA0G

330

JA0

20

2,000

HHXC250ARA331MJA0G

35

150

HA0

27

1,600

HHXC350ARA151MHA0G

270

JA0

20

2,000

HHXC350ARA271MJA0G

◆ RECOMMENDED REFLOW SOLDERING CONDITIONS

The following conditions are recommended for air convection and infrared reflow soldering on the SMD products on to a glass epoxy

circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm.

The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.

Reflow should be performed twice or less.

Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃ ) before the second reflow.

●

Reflow Profile

Size Code

Preheat

Time maintained

above 217℃

Time maintained

above 230℃

Peak temp.

Reflow number

HA0, JA0

150 to 180℃

120 sec. max.

50 sec. max.

40 sec. max.

260℃ max.

1-cycle only

245℃ max.

2-cycle allowed

PMA

Series

◆STANDARD RATINGS

●Recommended Solder Land(Based on the PX series) [mm]

●Reflow Profile

Location of capacitor

c

a

b

b

Solder land on PC board

217

230

Peak

Preheat

Peak temperature

Time (sec.)

Max. period of time over 230℃

(℃)

Max. period of time over 217℃

◆RECOMMENDED REFLOW SOLDERING CONDITIONS

NIPPON CHEMI-CON CORPORATION

1595

Engineering Bulletin

Conductive Polymer

Aluminum Solid Capacitors

No.824C / Oct.2012

Tentative

2

Cap

(μF)

Rated ripple current

(mArms/100kHz)

Part No.

16

20

25

APMA160ARA680MF40S

40

F40

APMA160ARA151MF60S

18

F60

APMA160ARA390MF40S

2,200

3,300

2,200

2,700

4,100

2,700

40

F40

APMA200ARA470MF40S

45

F40

APMA200ARA151MF60S

20

F60

APMA160ARA221MF60S

2,100

3,200

3,300

2,600

3,700

4,100

18

F60

APMA250ARA220MF40S

50

F40

APMA250ARA560MF60S

26

F60

APMA250ARA150MF40S

2,000

2,800

2,000

2,400

3,400

2,400

50

544

1,200

312

470

1,500

1,760

275

700

187

F40

68

150

39

47

150

220

22

56

15

WV

Size

code

Leakage current

(µAmax/after 2min.)

ESR

(mΩmax/20℃,

100k to 300kHz)

Specifications in this bulletin are subject to change without notice.

Please ask us for technical specifications before purchase and use.

*1 Tx: Ambient temperature

Reflow number

Preheat

Time maintained

above 230℃

Peak temp.

16 to 25V

1-cycle only

150℃ to 180℃

120 sec.max.

50 sec.max.

250℃ max.

30 sec.max.

40 sec.max.

2-cycle allowed

Time maintained

above 217℃

40 sec.max.

Size code

a

b

c

F40,F60

1.6

3.5

1.9

Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

1.0

1.4

1.9

2.3

3.1

4.5

4.0

6.0

6.0

Reflow soldering

Reflow the capacitors within recommended reflow soldering conditions.

Verify there is no temperature stress to the capacitors because the follow-

ing differences might degrade capacitors electrically and mechanically.

Please consult us if other reflow conditions are employed.

1.Location of components : Temperature increases at the edge of PC

board more than the center.

2.Population of PC board : The lower the component population is, the

more temperature rises.

3.Material of PC board : A ceramic made board needs more heat than a

glass epoxy made board. The heat increase may cause damage to the

capacitors.

4.Thickness of PC board : A thicker board needs more heat than a thin-

ner board. The heat increase may damage the capacitors.

5.Size of PC board : A larger board needs more heat than a smaller

board. The heat increase may damage the capacitors.

6.Solder thickness

If very thin cream solder paste is to be used for SMD types, please

consult with us.

7.Location of infrared ray lamps : IR reflow as well as hot plate reflow

heats only on the reverse side of the PC board to lessen heat stress to

the capacitors.

8.Vapor phase soldering (VPS) is not used.

RECOMMENDED SOLDERING CONDITIONS

MVL/MVJ/MVH/MHL/MHB/MHJ/MHK/MKB/MV-BP/MVK-BP

217

230

Peak

Preheat

Peak temp.

Time (sec.)

Max. period of time over 217

℃

Max. period of time over 230

℃

D55, D60, D61, D73

E55, E60, E61, E73

F55, F60, F61, F73, F80, F90

H63

HA0

JA0

KE0, KG5

LH0, LN0

MH0, MN0

Size code

Terminal code : A

Terminal code : G

a

b

2.6

3.0

3.5

4.5

4.2

4.4

5.7

6.9

7.9

c

1.6

1.6

1.6

1.6

2.2

2.2

2.5

2.5

2.5

a

3.1

4.5

3.4

4.7

4.7

b

4.2

4.4

6.3

7.8

8.8

c

3.5

3.5

9.3

9.6

9.6

●

Recommended Solder Land on PC Board

c

b

a

: Solder land on PC board

Location of capacitor

b

◆PRECAUTIONS FOR USERS

Rework of soldering

Use a soldering iron for rework. Do not exceed an iron tip temperature of

380

±10℃ and an exposure time of 3±0.5 seconds.

Mechanical stress

Do not use the capacitors for lifting the PC board and give stress to the

capacitor. Avoid bending the PC board. This may damage the capacitors.

Cleaning assembly board

Immediately after solvent cleaning, remove residual solvent with an air

knife for at least 10 minutes. If the solvent is insufficiently dry, the capaci-

tors may corrode.

Coating on assembly board

1.Before curing coating material, remove the cleaning solvents from the

assembly board.

2.Before conformal coating, a chloride free pre-coat material is recom-

mended to decrease the stress on the capacitors.

Molding with resin

Internal chemical reaction gradually produces gas in the capacitor; then,

increasing internal pressure. If the end seal of the capacitor is completely

coverd by resin the gas will be unable to escape causing a potentially

dangerous situation. The chlorine contained resin will penetrate into the

end seal, reach the inside element, and cause damage of the capacitor.

Others

Refer to PRECAUTIONS AND GUIDELINES.

Soldering method

The capacitors of Alchip-series have no capability to withstand such dip

or wave soldering as totally immerses components into a solder bath.

Size code

D55 to F90

H63 to JA0

KE0 to MN0

SMD type

Vertical

4 to 50V

6.3 to 50V

63 to 450V

Voltage

range

Preheat

150 to 180

℃

120sec. max.

90sec. max

60sec. max.

60sec. max.

30sec. max.

30sec. max.

20sec. max.

60sec. max.

40sec. max.

30sec. max.

20sec. max.

20sec. max.

-

260

℃max.

250

℃max.

245

℃max.

240

℃max.

240

℃max.

230

℃max.

Time maintained

above 217

℃

Peak temp.

2 times or less

2 times or less

2 times or less

2 times or less

2 times or less

2 times or less

Reflow number

Time maintained

above 230

℃

63 to 100,

400V

4 to 63V

(Except 63V

for MVH)

The following conditions are recommended for air convection and infrared reflow soldering on the SMD products onto a glass epoxy

circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm for D55 to KG5 case code SMD

capacitors and 180×90×0.8mm for LH0 to MN0 case codes SMD capacitors.

The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.

Reflow should be performed twice or less.

Please ensure that the capacitor became cold enough to the room temperature (5 to 35

℃) before the second reflow.

Consult with us when performing reflow profile in IPC / JEDEC (J-STD-020)

●

Recommended soldering heat conditions (Except for Conductive Polymer Aluminum Solid Capacitors)

Reflow soldering

Reflow the capacitors within recommended reflow soldering conditions.

Verify there is no temperature stress to the capacitors because the follow-

ing differences might degrade capacitors electrically and mechanically.

Please consult us if other reflow conditions are employed.

1.Location of components : Temperature increases at the edge of PC

board more than the center.

2.Population of PC board : The lower the component population is, the

more temperature rises.

3.Material of PC board : A ceramic made board needs more heat than a

glass epoxy made board. The heat increase may cause damage to the

capacitors.

4.Thickness of PC board : A thicker board needs more heat than a thin-

ner board. The heat increase may damage the capacitors.

5.Size of PC board : A larger board needs more heat than a smaller

board. The heat increase may damage the capacitors.

6.Solder thickness

If very thin cream solder paste is to be used for SMD types, please

consult with us.

7.Location of infrared ray lamps : IR reflow as well as hot plate reflow

heats only on the reverse side of the PC board to lessen heat stress to

the capacitors.

8.Please consult us about vapor phase soldering (VPS).

[mm]

◆SURFACE MOUNT TYPE

●

Recommended soldering heat conditions

Flow soldering

　：260±5℃ for 10+1 seconds

Hand soldering

　：380±10℃ for 3±0.5 seconds

◆RADIAL LEAD AND SNAP-IN TYPE

76

CAT. No. E1001O

ALUMINUM ELECTROLYTIC CAPACITORS