HCPL4200 datasheet(4/12 Pages) HP

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1-326

Absolute Maximum Ratings

(No Derating Required up to 70°C)

Storage Temperature ......................................................... -55°C to +125°C

Operating Temperature ....................................................... -40°C to +85°C

Lead Solder Temperature ..... 260°C for 10 s (1.6 mm below seating plane)

Supply Voltage – VCC ...................................................................... 0 V to 20 V

Average Input Current - II ................................................. -30 mA to 30 mA

Peak Transient Input Current - II ..................................................... 0.5 A[1]

Enable Input Voltage – VE ...................................................... -0.5 V to 20 V

Output Voltage – VO ............................................................... -0.5 V to 20 V

Average Output Current – IO .............................................................. 25 mA

Input Power Dissipation – PI ......................................................... 90 mW[2]

Output Power Dissipation – PO ................................................... 210 mW[3]

Total Power Dissipation – P ......................................................... 255 mW[4]

Infrared and Vapor Phase Reflow Temperature

(Option #300) ................................................ see Fig. 1, Thermal Profile

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Power Supply Voltage

VCC

4.5

2 0

Volts

Forward Input Current

ISI

2.0

(SPACE)

Forward Input Current

IMI

1 4

2 4

(MARK)

Operating Temperature

7 0

°C

Fan Out

TTL Loads

Logic Low Enable

VEL

0.8

Volts

Voltage

Logic High Enable

VEH

2.0

2 0

Volts

Voltage

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