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LMV1012 датащи(PDF) 13 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
номер детали LMV1012
подробное описание детали  Pre-Amplified IC?셲 for High Gain 2-Wire Microphones
PDF  15 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

LMV1012 датащи(HTML) 13 Page - National Semiconductor (TI)

Back Button LMV1012 Datasheet HTML 7Page - National Semiconductor (TI) LMV1012 Datasheet HTML 8Page - National Semiconductor (TI) LMV1012 Datasheet HTML 9Page - National Semiconductor (TI) LMV1012 Datasheet HTML 10Page - National Semiconductor (TI) LMV1012 Datasheet HTML 11Page - National Semiconductor (TI) LMV1012 Datasheet HTML 12Page - National Semiconductor (TI) LMV1012 Datasheet HTML 13Page - National Semiconductor (TI) LMV1012 Datasheet HTML 14Page - National Semiconductor (TI) LMV1012 Datasheet HTML 15Page - National Semiconductor (TI)  
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Physical Dimensions inches (millimeters) unless otherwise noted
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA.
4-Bump Extreme Thin micro SMD
NS Package Number XPA04HLA
X
1 = 0.955 mm
X
2 = 1.031 mm
X
3 = 0.300 mm
www.national.com
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