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IS22C040 датащи(PDF) 5 Page - Integrated Silicon Solution, Inc

номер детали IS22C040
подробное описание детали  32 to 40 SEC INSTANT VOICE ROM
PDF  11 Pages
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производитель  ISSI [Integrated Silicon Solution, Inc]
домашняя страница  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS22C040 датащи(HTML) 5 Page - Integrated Silicon Solution, Inc

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ISSI®
IS22C040
Integrated Silicon Solution, Inc.
5
VP009-1C
10/01/98
DC CHARACTERISTICS
Symbol
Parameter Description
Condition
Min.
Typ.
Max.
Unit
VCC
Operating Voltage
3.0
4.5
6.0
V
ISB
Standby Current
VCC = 3.0V, I/O Open
—
1
5
µA
IOP
Operating Current
Vcc = 3.0V, I/O Open
—
—
100
µA
VIH
Input HIGH Voltage
Vcc = 3.0V
2.5
3.0
3.5
V
VIL
Input LOW Voltage
Vcc = 3.0V
–0.3
0
0.3
V
IOH
VOUT LOW O/P Current
Vcc = 3.0V, VOUT = 0V
—
–12
—
mA
IOL
VOUT HIGH O/P Current
Vcc = 3.0V, VOUT = 3.0V
—
12
—
mA
ICO
COUT O/P Current
Vcc = 3.0V, VCOUT = 0.7V
—
–2
—
mA
ISTPH
STP LOW O/P Current
Vcc = 3.0V, VSTP = 0V
—
–5
—
mA
TSTPL
STP HIGH O/P Current
Vcc = 3.0V, VSTP = 3.0V
—
5
—
mA
ILED
Output Current LED
Vcc = 3.0V – 6.0V
6
8
10
mA
∆F/F
Frequency Stability
FOSC(3V) – FOSC(3.5V)
—
—
5
%
FOSC (3V)
BONDING PARAMETERS
Pin
Name
X
Y
1
S8
3451.9
1599.7
2
LED1
3451.9
1861.0
3VOUT1
3451.9
2147.6
4VOUT2
3451.9
2444.5
5
GND
3368.10
2803.35
6
STP
137.18
2795.93
7
LED2
100.4
2486.3
8COUT
100.4
2245.0
9
OSC
100.4
1790.0
10
S5
100.4
1469.5
11
S6
100.4
1230.0
12
VPP
100.4
989.6
13
S1
100.4
662.3
14
S2
100.4
422.7
15
VCC
187.05
113.78
16
S3
3372.5
141.8
17
S4
3451.9
581.5
18
SBT
3451.9
836.0
19
IRP
3451.9
1090.6
20
S7
3451.94
1345.13
BONDING DIAGRAM
(0,0)
X
Y
Note: Substrate must be connected to GND
Pad size = 100
µm x 100 µm
5
4
3
2
1
20
19
18
17
16
6
7
8
9
10
11
12
13
14
15



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