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CLC427 датащи(PDF) 6 Page - National Semiconductor (TI) |
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CLC427 датащи(HTML) 6 Page - National Semiconductor (TI) |
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6 / 8 page ![]() http://www.national.com 6 The maximum power that the package can dissipate at a given temperature is illustrated in the Power Derating curves in the Typical Performance section. The power derating curve for any package can be derived by utilizing the following equation: where: Tamb = Ambient temperature (°C) θ JA = Thermal resistance, from junction to ambient, for a given package (°C/W) Layout Considerations A proper printed circuit layout is essential for achieving high frequency performance. Comlinear provides evalu- ation boards for the CLC427 (730038 - DIP, 730036- SOIC) and suggests their use as a guide for high frequency layout and as an aid for device testing and characterization. General layout and supply bypassing play major roles in high frequency performance. Follow the steps below as a basis for high frequency layout: 1. Include 6.8 µF tantalum and 0.1µF ceramic capacitors on both supplies. 2. Place the 6.8 µF capacitors within 0.75 inches of the power pins. 3. Place the 0.1 µF capacitors within 0.1 inches of the power pins. 4. Remove the ground plane under and around the part, especially near the input and output pins to reduce parasitic capacitance. 5. Minimize all trace lengths to reduce series inductances. Additional information is included in the evaluation board literature. Typical Application Circuit The typical application shown on the front page illustrates the near rail-to-rail performance of the CLC427. Multiple Feedback Bandpass Filter Figure 9 illustrates a bandpass filter and design equations. The circuit operates from a single supply of +5V. The voltage divider biases the non-inverting input to 2.5V. The input is AC coupled to prevent the need for level shifting the input signal at the source. Use the design equations to determine R1 and R2 based on the desired Q and center frequency. This example illustrates a bandpass filter with Q = 4 and center frequency fc = 1MHz. Figure 10 indicates the filter response. Figure 9: Bandpass Filter Topology Figure 10: Bandpass Response Distribution Amplifier Figure 11 illustrates a distribution amplifier. The topology utilizes the dual amplifier package. The input is AC coupled and the non-inverting terminals of both amplifiers are biased at 2.5V. Figure 11: Distribution Amplifier 175 Tamb JA °− () θ Applications Circuits Frequency (MHz) 40 30 20 -10 1 10 10 0 30.6dB 940kHz + - 1/2 CLC427 R2 3.16k Ω 0.1 µF 6.8 µF Vo Vin +5V 5.1k Ω 3(5) 2(6) 4 8 1(7) 5.1k Ω + C 390pF C 390pF R1 50 Ω R Q fc f resonant frequency R R 4Q A 2Q A mid band gain 2 r r 1 2 2 2 == == = − π + - 1/2 CLC427 Rf 0.1 µF 6.8 µF Vo1 Vin +5V Rg R 3(5) 2(6) 8 1(7) C CC R + Ro Ro Ro Zo + - 1/2 CLC427 Rf Vo2 Rg 3(5) 2(6) 4 1(7) C Ro Ro Zo |
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