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PowerPAD is a trademark of Texas Instruments

DGN (S-PDSO-G8)

THERMAL INFORMATION

THERMAL PAD MECHANICAL DATA

PPTD041

Exposed Thermal Pad

5

4

8

1

1,78

MAX

1,73

MAX

This PowerPAD™ package incorporates an exposed thermal pad that is designed to be attached directly to an

external heatsink. When the thermal pad is soldered directly to the printed circuit board (PCB), the PCB can be

used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to a

ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer from

the integrated circuit (IC).

The exposed thermal pad dimensions for this package are shown in the following illustration.

For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,

refer to Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002

and Application Brief, PowerPAD Made Easy , Texas Instruments Literature No. SLMA004. Both documents are

available at www.ti.com.

Exposed Thermal Pad Dimensions

NOTE: All linear dimensions are in millimeters

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