RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140506

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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RFFM4293

Pin Names and Descriptions

Pin

Name

Description

1

PDET

Power detector voltage for Tx section. PDET voltage varies with output power. May need external decoupling

for noise decoupling.

2

NC

No connect pin.

3

VCC

Supply voltage for the PA. See applications schematic for biasing and bypassing components.

4

VCC

Supply voltage for the PA. See applications schematic for biasing and bypassing components.

5

TX

RF input port for the 802.11b/g/n/ac PA. Input is matchined to 50

Ω and DC block is provided internally.

6

PA_EN

Control voltage for the PA and Tx switch. See truth table for proper settings.

7

NC

No connect pin.

8

RX

RF output port for the 802.11b/g/n/ac LNA. Input is matchined to 50

Ω and DC block is provided internally.

9

LNA_EN

Control voltage for the LNA. When this pin is set to a LOW logic state, the bypass mode is enabled.

10

VDD

Supply voltage for the LNA. See applications schematic for biasing and bypassing components.

11

BT

RF Bidirectional port for Bluetooth

Ω and DC block is provided internally.

12

GND

Ground connection.

13

C_BT

Bluetooth

14

C_RX

Receive switch control pin. See Switch Truth Table for proper level.

15

GND

Ground connection.

16

ANT

RF bidirectional antenna port matched to 50

Ω and is DC blocked internally.

Pkg Base

GND

Ground connection. The backside of the package should be connected to the ground plane through a short

path, i.e., PCB vias under the device are recommended.