PI3B3245LE datasheet(4/5 Pages) PERICOM

4 / 5 page

www.pericom.com

PS8162i

12/08/10

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PI3B3245

3.3V, Hot Insertion, 8-Bit, 2-Port NanoSwitchTM

Packaging Mechanical: 20-Pin QSOP (Q)

.337

.344

.053

.069

.004

.010

SEATING

PLANE

.025

BSC

.007

.010

.228

.244

.150

.157

X.XX

DENOTES DIMENSIONS

IN MILLIMETERS

0.635

8.56

8.74

1.35

1.75

5.79

6.19

0.101

0.254

.008

.012

0.203

0.305

3.81

3.99

0.178

0.254

.058

1.47

.015 x 45˚

0.38

REF

Detail A

.008

0.20

MIN.

Guage Plane

.010

0.254

.041

1.04

REF

.016

.035

0.41

0.89

0˚-6˚

.008

.013

0.20

0.33

DESCRIPTION: 20-Pin, 150-Mil Wide, QSOP

PACKAGE CODE: Q

DOCUMENT CONTROL NO.

PD - 1202

REVISION: H

DATE: 10/22/07

Note:

1) Controlling dimensions in inches.

2) Ref: JEDEC MO-137B/AD

3) Dimensions do not include mold flash, protrusions or gate burrs

Pericom Semiconductor Corporation

3545 N. 1st Street, San Jose, CA 95134

1-800-435-2335 • www.pericom.com

Packaging Mechanical: 20-Pin TSSOP (L)

DESCRIPTION: 20-Pin, 173-Mil Wide, TSSOP

PACKAGE CODE: L

DOCUMENT CONTROL NO.

PD - 1311

REVISION: E

DATE: 03/09/05

Pericom Semiconductor Corporation

3545 N. 1st Street, San Jose, CA 95134

1-800-435-2336 • www.pericom.com

.252

.260

.047

1.20

.002

.006

SEATING

PLANE

.0256

BSC

.018

.030

.004

.008

.238

.269

.169

.177

0.05

0.15

6.1

6.7

0.45

0.75

0.09

0.20

4.3

4.5

6.4

6.6

0.65

0.19

0.30

.007

.012

Max

Note:

1. Package Outline Exclusive of Mold Flash and Metal Burr

2. Controlling dimentions in millimeters

3. Ref: JEDEC MO-153F/AC

10-0247

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