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MB91F587LD датащи(PDF) 173 Page - SPANSION |
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MB91F587LD датащи(HTML) 173 Page - SPANSION |
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173 / 177 page ![]() D at aS h ee t 170 MB91F587LA_DS705-00012-2v0-E, August 22, 2014 CONFIDENTIAL PACKAGE DIMENSIONS 144-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 1.20 g Code (Reference) P-LFQFP144-20 ×20-0.50 144-pin plastic LQFP (FPT-144P-M08) (FPT-144P-M08) C 2003-2010 FUJITSU SEMICONDUCTOR LIMITED F144019S-c-4-8 Details of "A" part 0.25(.010) (Stand off) (.004±.004) 0.10±0.10 (.024±.006) 0.60±0.15 (.020±.008) 0.50±0.20 1.50 +0.20 –0.10 +.008 –.004 .059 0°~8° 0.50(.020) "A" 0.08(.003) 0.145±0.055 (.006±.002) LEAD No. 1 36 INDEX 37 72 73 108 109 144 0.22±0.05 (.009±.002) M 0.08(.003) 22.00±0.20(.866±.008)SQ (Mounting height) * 20.00±0.10(.787±.004)SQ Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) *:Values do not include resin protrusion. Resin protrusion is +0.25(.010)Max(each side). Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/en-search/ |
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