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ADC12L030CIWM датащи(PDF) 30 Page - National Semiconductor (TI) |
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ADC12L030CIWM датащи(HTML) 30 Page - National Semiconductor (TI) |
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30 / 36 page ![]() Application Hints (Continued) 4.0 ANALOG INPUT VOLTAGE RANGE The ADC12L030/2/4/8’s fully differential ADC generate a two’s complement output that is found by using the equa- tions shown below: for (12-bit) resolution the Output Code = for (8-bit) resolution the Output Code = Round off to the nearest integer value between −4096 to 4095 for 12-bit resolution and between −256 to 255 for 8-bit resolution if the result of the above equation is not a whole number. Examples are shown in the table below: Digital VREF + VREF − VIN + VIN − Output Code +2.5V +1V +1.5V 0V 0,1111,1111,1111 +2.500V 0V +2V 0V 0,1100,1100,1101 +2.500V 0V +2.499V +2.500V 1,1111,1111,1111 +2.500V 0V 0V +2.500V 1,0000,0000,0000 5.0 INPUT CURRENT At the start of the acquisition window (t A) a charging current flows into or out of the analog input pins (A/DIN1 and A/DIN2) depending on the input voltage polarity. The analog input pins are CH0–CH7 and COM when A/DIN1 is tied to MUXOUT1 and A/DIN2 is tied to MUXOUT2. The peak value of this input current will depend on the actual input voltage applied, the source impedance and the internal multiplexer switch on resistance. With MUXOUT1 tied to A/DIN1 and MUXOUT2 tied to A/DIN2 the internal multiplexer switch on resistance is typically 1.6 k Ω. The A/DIN1 and A/DIN2 mux on resistance is typically 750 Ω. 6.0 INPUT SOURCE RESISTANCE For low impedance voltage sources (<600 Ω), the input charging current will decay, before the end of the S/H’s ac- quisition time of 2 µs (10 CCLK periods with f C = 5 MHz), to a value that will not introduce any conversion errors. For high source impedances, the S/H’s acquisition time can be in- creased to 18 or 34 CCLK periods. For less ADC resolution and/or slower CCLK frequencies the S/H’s acquisition time may be decreased to 6 CCLK periods. To determine the number of clock periods (N c) required for the acquisition time with a specific source impedance for the various resolutions the following equations can be used: 12 Bit + Sign NC = [RS + 2.3] x fC x 0.824 8 Bit + Sign NC = [RS + 2.3] x fC x 0.57 Where f C is the conversion clock (CCLK) frequency in MHz and R S is the external source resistance in kΩ. Asanex- ample, operating with a resolution of 12 Bits+sign,a5MHz clock frequency and maximum acquistion time of 34 conver- sion clock periods the ADC’s analog inputs can handle a source impedance as high as 6 k Ω. The acquisition time may also be extended to compensate for the settling or response time of external circuitry connected between the MUXOUT and A/DIN pins. The acquisition time (t A) is started by a falling edge of SCLK and ended by a rising edge of CCLK (see Timing Diagrams). If SCLK and CCLK are asynchronous one extra CCLK clock period may be inserted into the programmed acquisition time for synchronization. Therefore with asnychronous SCLK and CCLK the acquisition time will change from conversion to conversion. 7.0 INPUT BYPASS CAPACITANCE External capacitors (0.01 µF–0.1 µF) can be connected be- tween the analog input pins, CH0–CH7, and analog ground to filter any noise caused by inductive pickup associated with long input leads. These capacitors will not degrade the con- version accuracy. 8.0 NOISE The leads to each of the analog multiplexer input pins should be kept as short as possible. This will minimize input noise and clock frequency coupling that can cause conversion er- rors. Input filtering can be used to reduce the effects of the noise sources. 9.0 POWER SUPPLIES Noise spikes on the V A + and V D + supply lines can cause conversion errors; the comparator will respond to the noise. The ADC is especially sensitive to any power supply spikes that occur during the auto-zero or linearity correction. The minimum power supply bypassing capacitors recommended are low inductance tantalum capacitors of 10 µF or greater paralleled with 0.1 µF monolithic ceramic capacitors. More or different bypassing may be necessary depending on the overall system requirements. Separate bypass capacitors should be used for the V A + and V D + supplies and placed as close as possible to these pins. 10.0 GROUNDING The ADC12L030/2/4/8’s performance can be maximized through proper grounding techniques. These include the use of separate analog and digital ground planes. The digital ground plane is placed under all components that handle digital signals, while the analog ground plane is placed under all components that handle analog signals. The digital and analog ground planes are connected together at only one point, either the power supply ground or at the pins of the ADC. This greatly reduces the occurence of ground loops and noise. Shown in Figure 16 is the ideal ground plane layout for the ADC12L038 along with ideal placement of the bypass ca- pacitors. The circuit board layout shown in Figure 16 uses three bypass capacitors: 0.01 µF (C1) and 0.1 µF (C2) sur- face mount capacitors and 10 µF (C3) tantalum capacitor. 11.0 CLOCK SIGNAL LINE ISOLATION The ADC12L030/2/4/8’s performance is optimized by routing the analog input/output and reference signal conductors as far as possible from the conductors that carry the clock sig- nals to the CCLK and SCLK pins. Ground traces parallel to the clock signal traces can be used on printed circuit boards to reduce clock signal interference on the analog input/ output pins. www.national.com 30 |
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