ADC10064CIWM datasheet(5/14 Pages) NSC

5 / 14 page

DC Electrical Characteristics (Continued)

The following specifications apply for V

+ = +5V, V

REF(+) = 5V VREF(−) = GND, and Speed Adjust pin unconnected unless other-

wise specified. Boldface limits apply for T

A = TJ = TMIN to TMAX; all other limits TA = TJ = +25˚C.

Symbol

Parameter

Conditions

Typical

(Note 7)

Limit

(Note 8)

Units

(Limit)

OUT(0)

Logical “0” Output Voltage

+ = 4.5V, I

OUT = 1.6 mA

0.4

V (max)

OUT

TRI-STATE® Output Current

OUT = 5V

OUT = 0V

0.1

−0.1

−50

µA (max)

CC Supply Current

CS = S/H = RD = 0, R

SA = ∞

CS = S/H = RD = 0, R

SA = 18 kΩ

1.0

mA (max)

CC Supply Current

CS = S/H = RD = 0, R

SA = ∞

CS = S/H = RD = 0, R

SA = 18 kΩ

mA (max)

AC Electrical Characteristics

The following specifications apply for V

+ = +5V, t

r = tf = 20 ns, VREF(+) = 5V, VREF(−) = GND, and Speed Adjust pin uncon-

nected unless otherwise specified. Boldface limits apply for T

A = TJ = TMIN to TMAX; all other limits TA = TJ = +25˚C.

Symbol

Parameter

Conditions

Typical

(Note 7)

Limit

(Note 8)

Units

(Limit)

CONV

Mode 1 Conversion Time from

Rising Edge of S/H to Falling Edge

of INT

SA = ∞

SA = 18k

600

375

750/900

ns(max)

CRD

Mode 2 Conversion Time

SA = ∞

Mode 2, R

SA = 18k

850

530

1400

ns(max)

ACC1

Access Time (Delay from Falling

Edge of RD to Output Valid)

Mode 1; C

L = 100 pF

ns (max)

ACC2

Access Time (Delay from Falling

Edge of RD to Output Valid)

Mode 2; C

L = 100 pF

900

CRD +50

ns (max)

Minimum Sample Time

(

Figure 1); (Note 8)

250

ns (max)

1H,t0H

TRI-STATE Control (Delay from

Rising Edge of RD to High-Z State)

L = 1k, CL = 10 pF

ns (max)

INTH

Delay from Rising Edge of RD to

Rising Edge of INT

L = 100 pF

ns (max)

Delay from End of Conversion to

Next Conversion

ns (max)

Multiplexer Control Setup Time

ns (max)

Multiplexer Hold Time

ns (max)

VIN

Analog Input Capacitance

pF (max)

OUT

Logic Output Capacitance

pF (max)

Logic Input Capacitance

pF (max)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-

tional. These ratings do not guarantee specific performance limits, however. For guaranteed specifications and test conditions, see the Electrical Characteristics. The

guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed

test conditons.

Note 2: All voltages are measured with respect to GND, unless otherwise specified.

Note 3: When the input voltage (VIN) at any pin exceeds the power supply rails (VIN < GND or VIN > V

+) the absolute value of current at that pin should be limited

to 5 mA or less. The 20 mA package input current limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.

Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum

allowable power dissipation at any temperature is PD = (TJMAX −TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. In most cases,

the maximum derated power dissipation will be reached only during fault conditions. For these devices, TJMAX for a board-mounted device can be found from the

tables below:

Device

JA (˚C/W)

ADC10061CIWM

ADC10062CIWM

ADC10064CIWM

Note 5: Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

Note 6: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National Semicon-

ductor Linear Data Book for other methods of soldering surface mount devices.

Note 7: Typicals are at +25˚C and represent must likely parametric norm.

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