DATA SHEET

SE2593A20: Dual-Band 802.11n Wireless LAN Front-End

Preliminary Information

Skyworks Solutions, Inc.

202431A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012

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PCB METAL & VIA HOLE

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PCB SOLDER MASK

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PCB SOLDER STENCIL

TOP (X-Ray) VIEW

RECOMMENDED FOOTPRINT NOTES:

4. VIA HOLE INFORMATION:

4a. RECOMMENDED VIA HOLE SIZE (Ø): 0.150 - 0.300mm

4b. RECOMMENDED VIA HOLE PITCH: AS SHOWN

4c. RECOMMENDED VIA WALL Cu PLATING: 30-35um

4d. RECOMMENDED THAT VIAS BE TENTED WITH SOLDERMASK ON PCB BACKSIDE AND

FILLED WITH SOLDER.

4e. VIA IN SIGNAL PAD DETAIL, TYP 10 PLCS.

4f. TOTAL VIA COUNT AS SHOWN: 30.

5. SOLDER MASK GEOMETRY FEATURES:

5a. ALL PERIPHERAL PCB PADS ARE NON-SOLDER MASK DEFINED.

5b. ALL GROUND PADDLE FEATURES ARE SOLDER MASK DEFINED.

6. SOLDER STENCIL APERTURE FEATURES:

6a. SOLDER STENCIL APERATURE OPENINGS ARE SMALLER THEN PERIPHERAL PCB METAL PADS.

6b. RECOMMENDED SOLDER STENCIL APERTURE ARRAY TO TARGET APPROXIMATELY

50 - 80% COVERAGE OF SOLDER MASK OPENINGS, EXCEPT AS NOTED.

7. RECOMMENDED SOLDER STENCIL THICKNESS: 5.0mils (0.127mm).

8. PCB ACAD AND GERBER FILES AVAILABLE UPON REQUEST.

CL

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GENERAL NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. DIMENSIONING AND TOLERANCES CONFORM TO ASME Y14.5M-1994.

(UNLESS OTHERWISE SPECIFIED THE FOLLOWING VALUES APPLY)

DECIMAL TOLERANCE:

ANGULAR TOLERANCE:

X.X (1 PLC) ± 0.1mm

± 1°

X.XX (2 PLC) ± 0.05mm

X.XXX (3 PLC) ± 0.025mm

3. UNLESS SPECIFIED DIMENSIONS ARE SYMMETRICAL ABOUT CENTER LINES.

PERIPHERAL PAD

PATTERN DETAIL

Figure 5: Recommended Land and Solder Patterns

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. The SE2593A20 is capable of

withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or

in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that

the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For

details on both attachment techniques, precautions, and handling procedures recommended, please refer to:



“Land Grid Array Module Solder Reflow & Rework Information”, Document Number QAD-00046.



“Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number QAD-00047.

Caution! Class 0 ESD sensitive