MICROWAVE CORPORATION

8 - 278

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

8

HMC461LP3

InGaP HBT 1 Watt High IP3

AMPLIFIER, 1.7 - 2.2 GHz

v01.0604

Evaluation PCB

The circuit board used in the final application should use

RF circuit design techniques. Signal lines should have

50 ohm impedance while the package ground leads

and exposed paddle should be connected directly to the

ground plane similar to that shown. A sufficient number

of VIA holes should be used to connect the top and

bottom ground planes. The evaluation board should be

mounted to an appropriate heat sink. The evaluation cir-

cuit board shown is available from Hittite upon request.

List of Materials

Item

Description

J1, J2

PC Mount SMA Connector

J3, J4

2 mm DC Header

C1, C2

2.2 µF Capacitor, Tantalum

C3, C4

100 pF Capacitor, 0402 Pkg.

C5, C6

5 pF Capacitor, 0402 Pkg.

C7, C8

0.8 pF Capacitor, 0402 Pkg.

C9, C10

4 pF Capacitor, 0402 Pkg.

L1, L2

8.2 nH Inductor, 0402 Pkg.

U1

HMC461LP3 Power Amplifier

U2, U3

Panasonic Balun, P/N EHFFD - 1619

PCB*

106483 Evaluation PCB, 10 mils

* Circuit Board Material: Rogers 4350, Er = 3.48

Pin Number

Description

1, 2, 3

GND

4, 5, 6

Vs

J3, J4

Specifications and data reflect HMC461LP3 measured with external baluns in a balanced

amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.

Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.