MICROWAVE CORPORATION

11 - 43

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

11

HMC369LP3

v01.0604

Absolute Maximum Ratings

Pin Locations & Outline Drawing

Typical Supply Current vs. Vcc

Vcc (V)

Icc (mA)

4.5

45

5.0

46

5.5

47

RF Input (Vcc= +5V)

+20 dBm

Vcc

+6.0V

Channel Temperature

150 °C

Continuous Pdiss (T=85 °C)

(derate 7 mW/°C above 85 °C)

450 mW

Thermal Resistance (R

(junction to ground paddle)

145 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

Note: Multiplier will operate over full voltage range

shown above.

SMT GaAs HBT MMIC x2 ACTIVE

FREQUENCY MULTIPLIER, 9.9 - 12.7 GHz OUTPUT

NOTES:

1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY

3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED

TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB

LAND PATTERN.