MICROWAVE CORPORATION

5 - 101

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

5

GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz

Handling Precautions

Follow these precautions to avoid permanent damage.

Cleanliness:

Handle the chips in a clean environment.

DO NOT attempt to clean the chip using liquid cleaning systems.

Static Sensitivity:

Follow ESD precautions to protect against > ± 250V ESD strikes.

Transients:

Suppress instrument and bias supply transients while bias is applied.

Use shielded signal and bias cables to minimize inductive pick-up.

General Handling:

Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers.

The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or

fingers.

Mounting

The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically con-

ductive epoxy. The mounting surface should be clean and flat.

Eutectic Die Attach:

A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature

of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C.

DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3

seconds of scrubbing should be required for attachment.

Epoxy Die Attach:

Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the

perimeter of the chip once it is placed into position.

Cure epoxy per the manufacturer’s schedule.

Wire Bonding

RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically

bonded with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are

recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams.

All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic

energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12

mils (0.31 mm).

HMC337

GaAs MMIC SUB-HARMONICALLY

PUMPED MIXER, 17 - 25 GHz

v01.0803