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SP800LCP датащи(PDF) 17 Page - Sipex Corporation

номер детали SP800LCP
подробное описание детали  Low Power Microprocessor Supervisory with Battery Switch-Over
PDF  24 Pages
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производитель  SIPEX [Sipex Corporation]
домашняя страница  http://www.sipex.com
Logo SIPEX - Sipex Corporation

SP800LCP датащи(HTML) 17 Page - Sipex Corporation

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Date: 5/25/04
SP691A/693A/800L/800M Low Power Microprocessor Supervisor with Battery Switch-Over © Copyright 2004 Sipex Corporation
17
and connect CE
OUT to the CE input of each
memory device as shown in Figure 26. The CE
input of each part then connects directly to the
chip-select logic, which does not have to gated
by the SP691A/693A/800L/800M devices.
Adding Hysteresis to the Power-Fail
Comparator
Hysteresis adds noise margin to the power-fail
comparator and prevents repeated triggering of
PFO when V
IN is near the power-fail comparator
trip point. Figure 27 shows how to add hysteresis
to the power-fail comparator. Select the ratio of
R1 and R2 such that PFI sees 1.25V when V
IN
falls to the desired trip point (V
TRIP). Resistor
R3 adds hysteresis. It will typically be an order
of magnitude greater than R1 or R2. The
current through R1 and R2 should be at least
1
µA to ensure that the 25nA (max) PFI input
current does not shift the trip point. R3 should
be larger than 10k
Ω to prevent it from loading
down the PFO pin. Capacitor C1 adds additional
noise rejection.
Monitoring a Negative Voltage
The power-fail comparator can be used to monitor
a negative supply voltage using the circuit shown
in Figure 28. When the negative supply is valid,
PFO is low. When the negative supply voltage
drops, PFO goes high. This circuit's accuracy is
affected by the PFI threshold tolerance, the VCC
voltage, and resistors R1 and R2.
Backup-Battery Replacement
The backup battery may be disconnected while
VCC is above the reset threshold. No precautions
are necessary to avoid spurious reset pulses.
Figure 26. Alternate Chip Enable Gating
GND
VOUT
RP*
2
CE
CE
CE
CE
CE
CE
CE
CE
Active-HIGH
CE Logic Lines
for Memory Devices
CEOUT
CEIN
13
4
12
*Minimum value of RP is 1kΩ.
Maximum value of RP is dependent
on the connected number of RAMs, n.
RAM1
RAM2
RAM3
RAMn
Figure 27. Adding Hysteresis to the Power-Fail
Comparator
PFI
PFO
R3
*C1
R2
R1
VIN
connect to µP
VCC
+5V
GND
PFO
VIN
+5V
VL
VH
VTRIP
0V
0V
*optional
VTRIP =
R2
R1 + R2
VH =
R2 || R3
R1 + R2 || R3
1.25
R2
=
VL - 1.25
R1
5.0 - 1.25
R3
+
1.25
1.25



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