Data Sheet

ADG5436F

Rev. B | Page 13 of 30

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 2. TSSOP Pin Configuration

Figure 3. LFCSP Pin Configuration

Table 7. Pin Function Descriptions

Pin No.

TSSOP

LFCSP

Mnemonic

Description

1

15

IN1/F1

Logic Control Input 1 (IN1). See Table 8.

Decoder Pin (F1). This pin is used together with the specific fault pin (SF) to indicate which input is in

a fault condition. See Table 9.

2

16

S1A

Overvoltage Protected Source Terminal 1A. This pin can be an input or output.

3

1

D1

Drain Terminal 1. This pin can be an input or output.

4

2

S1B

Overvoltage Protected Source Terminal 1B. This pin can be an input or output.

5

3

Most Negative Power Supply Potential.

6

4

GND

Ground (0 V) Reference.

7

7

NIC

No Internal Connection.

8

5

DR

overvoltage fault condition. The default condition of the drain is open-circuit when the pin is left

9

6

IN2/F2

Logic Control Input 2 (IN2). See Table 8.

Decoder Pin (F2). This pin is used together with the specific fault pin (SF) to indicate which input is in

a fault condition. See Table 9.

10

8

S2A

Overvoltage Protected Source Terminal 2A. This pin can be an input or output.

11

9

D2

Drain Terminal 2. This pin can be an input or output.

12

10

S2B

Overvoltage Protected Source Terminal 2B. This pin can be an input or output.

13

11

Most Positive Power Supply Potential.

14

12

EN

Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When

this pin is high, the INx logic inputs determine the on switches.

15

13

FF

Fault Flag Digital Output. This pin has a high output when the device is in normal operation or a low

output when a fault condition occurs on any of the Sxx inputs. The FF pin has a weak internal pull-up

that allows the signals to be combined into a single interrupt for larger modules that contain

multiple devices.

16

14

SF

Specific Fault Digital Output. This pin has a high output when the device is in normal operation, or a

low output when a fault condition is detected on a specific pin, depending on the state of F1 and F2

per Table 9.

EP

Exposed Pad

The exposed pad is connected internally. For increased reliability of the solder joints and maximum

1

2

3

4

5

6

7

8

NOTES

1. NIC = NO INTERNAL CONNECTION.

16

15

14

13

12

11

10

9

S1A

D1

S1B

NIC

GND

IN1/F1

FF

EN

S2A

DR

IN2/F2

D2

S2B

SF

ADG5436F

(Not to Scale)

TOP VIEW

12

11

10

1

3

4

9

2

NOTES

1. NIC = NO INTERNAL CONNECTION.

2. THE EXPOSED PAD IS INTERNALLY CONNECTED. FOR

INCREASED RELIABILITY OF THE SOLDER JOINTS AND

MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED

THAT THE PAD BE CONNECTED TO THE LOWEST

D1

S1B

GND

EN

S2B

D2

ADG5436F

TOP VIEW

(Not to Scale)