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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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UT699 датащи(PDF) 38 Page - Aeroflex Circuit Technology |
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UT699 датащи(HTML) 38 Page - Aeroflex Circuit Technology |
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38 / 41 page  38 7.0 Ordering Information UT699 LEON 3FT Package Option Associated Lead Finish (X) 352-CQFP (C) Gold (Z) 484-CLGA (C) Gold (S) 484-CCGA (A) Solder (C) 484-CBGA (A) Solder Lead Finish: (NOTE 1) (C) = Gold (A) = Solder Screening Level: (NOTE 2 & 3) (P) = Prototype (Temperature Range: 25oC only) (E) = HiRel (Temperature Range: -40 oC to +105oC) Case Outline: (X) = 352-Ceramic Quad Flat Package, Top Brazed (Z) = 484-Ceramic Land Grid Array (S) = 484-Ceramic Column Grid Array (C) = 484-Ceramic Ball Grid Array (High Temp Solder Balls) UT699 32-bit LEON 3FT UT699 - * * * Notes: 1. Lead finish (A or C) must be specified. 2. Prototype Flow per Aeroflex Manufacturing Flows Document. Devices are tested at 25oC only. Radiation is neither tested nor guaranteed. 3. HiRel Flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed. |
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