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74F240 датащи(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали 74F240
подробное описание детали  Octal Buffers/Line Drivers with TRI-STATE Outputs
PDF  10 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

74F240 датащи(HTML) 5 Page - National Semiconductor (TI)

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DC Electrical Characteristics (Continued)
Symbol
Parameter
54F74F
Units
VCC
Conditions
Min
Typ
Max
ICCH
Power Supply Current (’F240)
19
29
mA
Max
VO e HIGH
ICCL
Power Supply Current (’F240)
50
75
mA
Max
VO e LOW
ICCZ
Power Supply Current (’F240)
42
63
mA
Max
VO e HIGH Z
ICCH
Power Supply Current
40
60
mA
Max
VO e HIGH
(’F241 ’F244)
ICCL
Power Supply Current
60
90
mA
Max
VO e LOW
(’F241 ’F244)
ICCZ
Power Supply Current
60
90
mA
Max
VO e HIGH Z
(’F241 ’F244)
AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
tPLH
Propagation Delay
30
51
70
30
90
30
80
ns
tPHL
Data to Output (’F240)
20
35
47
20
60
20
57
tPZH
Output Enable Time (’F240)
20
35
47
20
65
20
57
tPZL
40
69
90
40
105
40
100
ns
tPHZ
Output Disable Time (’F240)
20
40
53
20
65
20
63
tPLZ
20
60
80
20
125
20
95
tPLH
Propagation Delay
25
40
52
20
65
25
62
ns
tPHL
Data to Output (’F241 ’F244)
25
40
52
20
70
25
65
tPZH
Output Enable Time
20
43
57
20
70
20
67
tPZL
(’F241 ’F244)
20
54
70
20
85
20
80
ns
tPHZ
Output Disable Time
20
45
60
20
70
20
70
tPLZ
(’F241 ’F244)
20
45
60
20
75
20
70
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
240241244
SCX
Temperature Range Family
Special Variations
74FeCommercia
QB e Military grade device with
54FeMilitary
environmental and burn-in
processing
Device Type
X e devices shipped in 13 reel
Package Code
Temperature Range
P e Plastic DIP
CeCommercial (0 Cto a70 C)
D e Ceramic DIP
MeMilitary (b55 Cto a125 C)
F e Flatpak
NOTE
L e Leadless Chip Carrier (LCC)
Not required for MSA package
S e Small Outline SOIC JEDEC
code
MSA e Shrink Small Outline Package (EIAJ SSOP)
(’244 only)
SJ e Small Outline SOIC EIAJ
5



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