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VNI8200XP-32 датащи(PDF) 32 Page - STMicroelectronics

номер детали VNI8200XP-32
подробное описание детали  Octal high-side smart power solid-state relay with serial
PDF  43 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

VNI8200XP-32 датащи(HTML) 32 Page - STMicroelectronics

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Thermal management
VNI8200XP-32
32/43
DocID027849 Rev 3
14
Thermal management
The power dissipation in the IC is the main factor that sets the safe operating condition of
the device in the application. Therefore, it must be taken into account very carefully.
Heatsinking can be achieved using copper on the PCB with proper area and thickness. The
following image shows the junction-to-ambient thermal impedance values for the
PowerSSO-36 package.
Figure 13: PowerSSO-36 thermal impedance vs. time
For instance, three cases have been considered using a PowerSSO-36 packaged with
copper slug soldered on a 1.6 mm thickness FR4 board with dissipating footprint (copper
thickness of 70 µm):
single layer PCB with just IC footprint dissipating area
double layer PCB with footprint dissipating area on the top side and a 2 cm
2
dissipating layer on the bottom side through 15 via holes
double layer PCB with footprint dissipating area on the top side and an 8 cm
2
dissipating layer on the bottom side through 15 via holes



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