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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ACT4529 датащи(PDF) 8 Page - Active-Semi, Inc |
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ACT4529 датащи(HTML) 8 Page - Active-Semi, Inc |
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8 / 13 page  ACT4529 Rev1, October 13th, 2015 Innovative PowerTM - 8 - www.active-semi.com Copyright © 2015 Active-Semi, Inc. APPLICATIONS INFORMATION PC Board Layout Guidance When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the IC. 1) Arrange the power components to reduce the AC loop size consisting of CIN, VIN pin, SW pin and the Schottky diode. 2) Place input decoupling ceramic capacitor CIN as close to VIN pin as possible. CIN is connected power GND with vias or short and wide path. 3) Use “Kelvin” or “4-wire” connection techniques from the sense resistor pads directly to the CSP and CSN pins. 4) Use copper plane and thermal vias for GND for best heat dissipation and noise immunity. 5) Use short trace connecting HSB-CHSB-SW loop. 6) SW pad is noise node switching from VIN to GND. It should be isolated away from the rest of circuit for good EMI and low noise operation. |
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