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ISO7240CFDWR датащи(PDF) 25 Page - Texas Instruments

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номер детали ISO7240CFDWR
подробное описание детали  High-Speed, Quad-Channel Digital Isolators
PDF  46 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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ISO7240CFDWR датащи(HTML) 25 Page - Texas Instruments

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0
50
100
150
200
250
300
0
50
100
150
200
T - Case Temperature - °C
C
V
at 3.6 V
CC1,2
V
at 5.5 V
CC1,2
10
100
0
250
500
750
1000
WORKING VOLTAGE (V
IORM) -- VPK
VIORM at 560-VPK
28 Years
880
120
ISO7240CF, ISO7240C, ISO7240M
ISO7241C, ISO7241M, ISO7242C, ISO7242M
www.ti.com
SLLS868R – SEPTEMBER 2007 – REVISED SEPTEMBER 2015
9.3.3 Life Expectancy vs. Working Voltage
Figure 16. Time-Dependant Dielectric Breakdown Testing Results
9.3.4 Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
θJA = 168°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C
156
Safety input, output, or
SOIC-
IS
mA
supply current
16
θJA = 168°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C
239
SOIC-
150
°C
TS
Maximum case temperature
16
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity
Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
Figure 17. SOIC-16
ΘJC Thermal Derating Curve per VDE
Copyright © 2007–2015, Texas Instruments Incorporated
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Product Folder Links: ISO7240CF ISO7240C ISO7240M ISO7241C ISO7241M ISO7242C ISO7242M



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