DocID025777 Rev 1

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ST2100

Package information

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Table 25 lists the mechanical data for the package shown in Figure 7.

The TFBGA (“Thin profile Fine Pitch Ball Grid Array”) package uses a grid of solder balls as

its connectors. The TFBGA package is noted for its compact size, high lead count and low

inductance, which allows lower voltages to be used.

Table 26 lists thermal characteristics for the TFGBA package.

Table 25. TFBGA 12 x 12 x 1.2 mm, 324 + 49 balls, 4R23 x 23, pitch 0.5 mm, ball 0.3 mm

package mechanical data

Symbol

Dimensions (mm)

Note

Min.

Typical

Max.

A1.20

(1)

1. The total profile height (dim. A) is measured from the seating plane to the top of the component.

The maximum total package height is calculated by the following methodology:

A1 typ. + A2 typ. + A3 typ. +

Thin profile: 1.00 < A . 1.20 mm / fine pitch: e < 1.00 mm pitch.

A1

0.15

A2

0.20

A4

0.585

b

0.25

0.30

0.35

(2)

2. The typical ball diameter before mounting is 0.30 mm.

D

11.85

12.00

12.15

D1

11.00

E

11.85

12.00

12.15

E1

11.00

e0.50

Z0.50

ddd

0.08

eee

0.15

(3)

3. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone “eee” perpendicular to datum “C” and located on true

position with respect to datums “A” and “B” as defined by “e”. The axis perpendicular to datum “C” of each

ball must lie within this tolerance zone.

fff

0.05

(4)

4. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone “fff” perpendicular to datum “C” and located on true

position as defined by “e”. The axis perpendicular to datum “C” of each ball must lie within this tolerance

zone. Each tolerance zone “fff” in the array is contained entirely in the respective zone “eee” above. The

axis of each ball must lie simultaneously in both tolerance zones.

Table 26. TFGBA package thermal characteristics

Symbol

Parameter

Value

Unit

1. Measured on a JESD51 2S2P test board.

Thermal resistance junction to ambient

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°C/W