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USB5534B датащи(PDF) 60 Page - Microchip Technology

номер детали USB5534B
подробное описание детали  4-Port SS/HS USB Hub Controller
PDF  73 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB5534B датащи(HTML) 60 Page - Microchip Technology

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USB5534B
DS00001681C-page 60
 2012 - 2015 Microchip Technology Inc.
6.5
Capacitance
Note 6-4
Capacitance TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V
6.5.1
PACKAGE THERMAL SPECIFICATIONS
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi-
layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are
based on the package body, die size, maximum power consumption, 70°C ambient temperature, and 125°C junction
temperature of the die.
Use the following formulas to calculate the junction temperature:
TJ = P x
JA + TA
TJ = P x
JT + TT
TJ = P x
JC + TC
TABLE 6-3:
PIN CAPACITANCE
Limits
Parameter
Symbol
MIN
TYP
MAX
Unit
Test Condition
Clock Input Capacitance
CXTAL
2
pF
All pins except USB pins and the pins
under the test tied to AC ground
Input Capacitance
CIN
5pF
Output Capacitance
COUT
10
pF
Symbol
USB5534B
(°C/W)
VELOCITY
(Meter/s)
JA
23.0
0
JT
0.1
0
JC
1.4
0
Symbol
Description
TJ
Junction temperature
P
Power dissipated
JA
Junction-to-ambient-temperature
JC
Junction-to-top-of-package
JT
Junction-to-bottom-of-case
TA
Ambient temperature
TC
Temperature of the bottom of the case
TT
Temperature of the top of the case



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