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USB2513 датащи(PDF) 43 Page - Microchip Technology |
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USB2513 датащи(HTML) 43 Page - Microchip Technology |
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43 / 57 page ![]() 2010 - 2015 Microchip Technology Inc. DS00001692C-page 43 USB251xB/xBi 6.2.1 PACKAGE THERMAL SPECIFICATIONS Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi- layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are based on the package body, die size, maximum power consumption, 85°C ambient temperature, and 125°C junction temperature of the die. Use the following formulas to calculate the junction temperature: TJ = P x JA + TA TJ = P x JT + TT TJ = P x JC + TC Max Power Supported = (TJ Max. Spec. x TAmb.)/ JA Symbol USB2512B/12Bi USB2513B/13Bi USB2514B/14Bi (°C/W) Velocity (meters/s) JA 40.1 0 35.0 1 JT 0.5 0 0.7 1 JC 6.3 0 6.3 1 TABLE 6-9: LEGEND Symbol Description TJ Junction temperature P Power dissipated JA Junction-to-ambient-temperature JC Junction-to-top-of-package JT Junction-to-bottom-of-case TA Ambient temperature TC Temperature of the bottom of the case TT Temperature of the top of the case |
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