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BGA430 датащи(PDF) 7 Page - Infineon Technologies AG |
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BGA430 датащи(HTML) 7 Page - Infineon Technologies AG |
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7 / 24 page ![]() AN 074 Rev E 7 / 24 19-November-2002 Applications Note No. 074 Silicon Discretes reverse isolation. Note that all of these results are taken in a 50 ohm system, and that results in a 75 ohm system will differ slightly. Circuit Design Issues Relevant to BGA430: 1) proper device grounding !! 2) proper bypassing of the VCC pin ! The BGA430 is an extremely high gain device (>30 dB @ 1 GHz) contained within a single SMT package. As a result, casual or sloppy PCB layout techniques which add undesired parasitic inductance between BGA430 ground leads and PCB ground plane will add enough feedback to adversely alter the BGA430’s gain and return loss. In cases of extremely poor grounding, sufficient feedback will be present to enable either gain “peaking” or even an oscillation. In addition, the VCC pin (Pin 1) needs to be bypassed with a capacitor that, with its self-inductance taken into account, approximates a short-circuit in the 1 to 2 GHz range. Generally a 0603 or 0402 case-size chip capacitor in the range of 15 – 22 pF is sufficient. A photo of a bare I.F. Amp PC board is shown in Figure 10, with a close-in view of the BGA430 mounting area. Note that seven (7) ground vias are provided for the BGA430 ground pins, including three ground vias located immediately underneath the device. Note the two ground holes provided for the bypass capacitor C2 (22pF) on the BGA430 VCC pin, and the close proximity of C2 to the VCC pin. To summarize: • The user must avoid any additional parasitic ground inductance between BGA430 ground pins and PCB ground plane. A sufficient number of ground vias need to be provided and these vias should be placed as close to the BGA430 as possible. • BGA430 VCC pin (Pin 1) must be bypassed carefully, and the bypass capacitor used must have its “cold” side well-grounded. If these two suggestions are carefully followed, a low-cost, single device solution may be used for some I.F. amplifier designs, requiring only 3 external elements. Figure 10. BGA430 Mounting Position on PC Board. Compare unpopulated (above) to populated (below) PCB images. Note locations and number of ground vias near BGA430 MMIC. Pin 1 (VCC) is pad at lower left. It needs to be pointed out that the BGA430 is designed to operate at a nominal supply voltage of +5 volts, with a current draw of approximately 23mA. However, if a higher output compression point is desired, the BGA430 may be safely run up to 6.5 volts, and maximum safe current is 35mA. If an adjustable output voltage regulator |
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