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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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EM3582-RTR датащи(PDF) 56 Page - Silicon Laboratories |
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EM3582-RTR датащи(HTML) 56 Page - Silicon Laboratories |
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56 / 59 page  EM358x 56 Rev 1.0 Table 6.4 contains the temperature profile parameters. 6.2. Part Marking Figure 6.7 shows the part marking for the EM358x Series. The circle in the top corner indicates Pin 1. Pins are numbered counter-clockwise from Pin 1 with 12 pins per package edge. Figure 6.7. Part Marking for EM358x Table 6.4. Solder Reflow Parameters Parameter Value Average Ramp Up Rate (from Tsoakmax to Tpeak) 3°C per second max Minimum Soak Temperature (Tsoakmin) 150°C Maximum Soak Temperature (Tsoakmax) 200°C TL 217°C Time above TL 60 – 150 seconds Tpeak 260 + 0°C Time within 5°C of Tpeak 20 – 40 seconds Ramp Down Rate 6°C per second max Time from 25°C to Tpeak 8 minutes, max Table 6.5. 48-Pin QFN Top Marking Explanation Mark Method: Laser Pin 1 Marking: Circle = 0.40 mm Diameter (Top-Left Justified) Line 1 Marking: Device Part Number Right Justified EM358x EM358x is the Orderable Part Number variant (EM3581/2/5/6/7/8) |
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