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ams Datasheet

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[v1-24] 2015-Aug-13

AS3729 − Absolute Maximum R atings

Stresses beyond those listed underAbsolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Electrical

Characteristicsis not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 5:

Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. Depending on actual PCB layout and PCB used.

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”.

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

Supply voltage to ground 5V

pins

-0.5

7.0

V

Applicable for pins VSUPx, LXx,

CTRLx

Supply voltage to ground 3V

pins

-0.5

5.0

V

Applicable for pin TEMP

Voltage difference between

ground terminals

-0.5

0.5

V

Applicable for pins PVSS, AGND

Input current

(latch-up immunity)

-100

100

mA

Norm: JEDEC JESD78

Continuous power dissipation

1

W

(1) for WL-CSP16 package

Electrostatic Discharge

ESD

Electrostatic discharge HBM

±1.5

kV

Norm: JEDEC JESD22-A114F

Temperature Ranges and Storage Conditions

Operating temperature

-40

85

°C

Junction to ambient thermal

resistance

°C/W

Junction temperature

125

°C

Storage temperature range

-55

125

°C

Package body temperature

260

°C

Norm IPC/JEDEC J-STD-020 (2)

Relative humidity

(non-condensing)

585

%

MSL

Moisture sensitivity level

1

Represents an unlimited floor

life time

Absolute Maximum Ratings