POWERDI is a registered trademark of Diodes Incorporated.

DMTH6004LPS

Document number: DS37769 Rev. 2 - 2

2 of 7

www.diodes.com

December 2015

© Diodes Incorporated

DMTH6004LPS

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

60

V

Gate-Source Voltage

±20

V

Continuous Drain Current (Note 5)

22

16

A

Continuous Drain Current (Note 6)

100

A

(Note 8)

100

Maximum Continuous Body Diode Forward Current (Note 6)

100

A

Pulsed Drain Current (10

s Pulse, Duty Cycle = 1%)

120

A

Avalanche Current, L = 0.2mH

40

A

Avalanche Energy, L = 0.2mH

160

mJ

Thermal Characteristic

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 5)

2.6

W

Thermal Resistance, Junction to Ambient (Note 5)

47

°C/W

Total Power Dissipation (Note 6)

138

W

Thermal Resistance, Junction to Case (Note 6)

0.9

°C/W

Operating and Storage Temperature Range

-55 to +175

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

60

-

-

V

Zero Gate Voltage Drain Current

-

-

1

μA

Gate-Source Leakage

-

-

±100

nA

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

1

-

3

V

Static Drain-Source On-Resistance

-

2.5

3.1

m

Ω

-

3.3

4.5

m

Ω

Diode Forward Voltage

-

-

1.3

V

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

-

4515

-

pF

f = 1MHz

Output Capacitance

-

1477

-

Reverse Transfer Capacitance

-

135.3

-

Gate Resistance

-

0.64

-

Ω

-

96.3

-

nC

-

47.4

-

Gate-Source Charge

-

14.1

-

Gate-Drain Charge

-

21.4

-

Turn-On Delay Time

-

9.9

-

ns

Turn-On Rise Time

-

17.7

-

Turn-Off Delay Time

-

53.5

-

Turn-Off Fall Time

-

32.9

-

Body Diode Reverse Recovery Time

-

49.7

-

ns

Body Diode Reverse Recovery Charge

-

78.9

-

nC

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.

6. Thermal resistance from junction to soldering point (on the exposed drain pad).

7 .Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to production testing.