MBR860MFS datasheet(2/4 Pages) ONSEMI

2 / 4 page

MBR860MFS, NRVB860MFS

http://onsemi.com

THERMAL CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Thermal Resistance, Junction−to−Case, Steady State

(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board)

RθJC

−

2.0

°C/W

ELECTRICAL CHARACTERISTICS

Instantaneous Forward Voltage (Note 1)

(iF = 8 Amps, TJ = 125°C)

(iF = 8 Amps, TJ = 25°C)

0.60

0.65

0.72

0.80

Instantaneous Reverse Current (Note 1)

(Rated dc Voltage, TJ = 125°C)

(Rated dc Voltage, TJ = 25°C)

0.015

0.150

1. Pulse Test: Pulse Width = 300

ms, Duty Cycle ≤ 2.0%.

TYPICAL CHARACTERISTICS

Figure 1. Typical Instantaneous Forward

Characteristics

Figure 2. Maximum Instantaneous Forward

Characteristics

VF, INSTANTANEOUS FORWARD VOLTAGE (V)

0.7

0.6

0.5

0.4

0.3

0.2

0.1

100

0.7

0.6

0.5

0.4

0.3

0.2

0.1

100

Figure 3. Typical Reverse Characteristics

Figure 4. Maximum Reverse Characteristics

VR, INSTANTANEOUS REVERSE VOLTAGE (V)

1.E−10

0.8

TA = 175°C

125

°C

150

°C

°C −40°C

0.8

0.9 1.0

TA = 175°C

125

°C

150

°C

°C −40°C

1.E−09

1.E−08

1.E−07

1.E−06

1.E−05

1.E−04

1.E−03

1.E−02

1.E−01

1.E+00

TA = 175°C

TA = 150°C

TA = 125°C

TA = 25°C

TA = −40°C

TA = 175°C

TA = 150°C

TA = 125°C

TA = 25°C

TA = −40°C

1.E−10

1.E−09

1.E−08

1.E−07

1.E−06

1.E−05

1.E−04

1.E−03

1.E−02

1.E−01

1.E+00

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