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MMDF5N02Z датащи(PDF) 5 Page - ON Semiconductor

номер детали MMDF5N02Z
подробное описание детали  N?묬hannel Power MOSFET
PDF  12 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMDF5N02Z датащи(HTML) 5 Page - ON Semiconductor

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Figure 8. Gate−To−Source and Drain−To−Source
Voltage versus Total Charge
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
Qg, TOTAL GATE CHARGE (nC)
02
4
1
6
ID = 5 A
TJ = 25°C
VGS
4
1
0
6
5
6
5
3
2
0
VDS
Q1
Q2
Q3
810
RG, GATE RESISTANCE (OHMS)
1
100
10
VDD = 6 V
ID = 5 A
VGS = 4.5 V
TJ = 25°C
td(on)
tr
100
10
td(off)
tf
3
2
4
12
14
1000
QT
DRAIN−TO−SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse re-
covery characteristics which play a major role in determin-
ing switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier de-
vice, therefore it has a finite reverse recovery time, trr, due
to the storage of minority carrier charge, QRR, as shown in
the typical reverse recovery wave form of Figure 11. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery fur-
ther increases switching losses. Therefore, one would like a
diode with short trr and low QRR specifications to minimize
these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current ring-
ing. The mechanisms at work are finite irremovable circuit
parasitic inductances and capacitances acted upon by high
di/dts. The diode’s negative di/dt during ta is directly con-
trolled by the device clearing the stored charge. However,
the positive di/dt during tb is an uncontrollable diode charac-
teristic and is usually the culprit that induces current ringing.
Therefore, when comparing diodes, the ratio of tb/ta serves
as a good indicator of recovery abruptness and thus gives a
comparative estimate of probable noise generated. A ratio of
1 is considered ideal and values less than 0.5 are considered
snappy.
Compared to ON Semiconductor standard cell density
low voltage MOSFETs, high cell density MOSFET diodes
are faster (shorter trr), have less stored charge and a softer re-
verse recovery characteristic. The softness advantage of the
high cell density diode means they can be forced through re-
verse recovery at a higher di/dt than a standard cell MOS-
FET diode without increasing the current ringing or the
noise generated. In addition, power dissipation incurred
from switching the diode will be less due to the shorter re-
covery time and lower switching losses.
0
0.2
0.4
0
1
2
3
VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
VGS = 0 V
TJ = 25°C
0.6
0.8
4
5
0.5
1.5
2.5
3.5
4.5
0.1
0.3
0.5
0.7



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