ISO7330C, ISO7330FC, ISO7331C, ISO7331FC

www.ti.com

SLLSEK9B – JANUARY 2015 – REVISED APRIL 2015

8.3 Feature Description

PRODUCT

CHANNEL DIRECTION

RATED ISOLATION

MAX DATA RATE

DEFAULT OUTPUT

ISO7330C

High

3 Forward,

0 Reverse

ISO7330FC

Low

(1)

25 Mbps

ISO7331C

High

2 Forward,

1 Reverse

ISO7331FC

Low

(1)

See the Regulatory Information section for detailed Isolation Ratings

8.3.1 High Voltage Feature Description

8.3.1.1 Package Insulation Specifications

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (clearance)

Shortest terminal-to-terminal distance through air

8

mm

Minimum external tracking

Shortest terminal-to-terminal distance across the

L(I02)

8

mm

(creepage)

package surface

Tracking resistance (comparative

CTI

DIN EN 60112 (VDE 0303-11); IEC 60112

>400

V

tracking index)

Minimum internal gap (internal

DTI

Distance through the insulation

13

µm

clearance)

Ω

Isolation resistance, input to

Ω

Isolation capacitance, input to

2

pF

2

pF

(1)

All pins on each side of the barrier tied together creating a two-terminal device.

(2)

Measured from input pin to ground.

NOTE

Creepage and clearance requirements should be applied according to the specific

equipment isolation standards of an application. Care should be taken to maintain the

creepage and clearance distance of a board design to ensure that the mounting pads of

the isolator on the printed-circuit board do not reduce this distance.

Creepage and clearance on a printed-circuit board become equal in certain cases.

Techniques such as inserting grooves and/or ribs on a printed circuit board are used to

help increase these specifications.

Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback

13

Product Folder Links: ISO7330C ISO7330FC ISO7331C ISO7331FC