LMP8481 datasheet(4/29 Pages) TI

4 / 29 page

LMP8480, LMP8481

SNVS829C – MARCH 1999 – REVISED SEPTEMBER 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

Over operating free-air temperature range (unless otherwise noted)

(3)

MIN

MAX

UNIT

Supply Voltage (VCC to GND)

–0.3

RSP or RSN to GND

–0.3

VOUT to GND

–0.3 to the lesser of (VCC + 0.3) or +20

Other VREF pin tied to ground

–0.3

VREF Pins

(LMP8481 Only)

Applied to both VREF Pins tied together

–0.3

Differential Input Voltage

–85

Current into output pin

–20(4)

Current into any other pins

–5(4)

Operating Temperature

–40

125

°C

Junction Temperature

-40

150

°C

Storage temperature

–65

150

°C

(1)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), θJA, and the ambient temperature,

TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) –TA)/ θJA or the number given in Absolute Maximum Ratings, whichever

is lower.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(4)

When the input voltage (VIN) at any pin exceeds power supplies (VIN < GND or VIN > VS ), the current at that pin must not exceed 5

mA, and the voltage (VIN) has to be within the Absolute Maximum Ratings for that pin. The 20-mA package input current rating limits

the number of pins that can safely exceed the power supplies with current flow to four pins.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±750

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Expected normal operating conditions over free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage (VCC)

4.5

Common Mode Voltage

4.0

VREFA and VREFB tied together

–0.3 to the lesser of (VCC – 1.5) or +6

Reference Input

–0.3 or +12 where the average of the

(LMP8481 Only)

Single VREF pin with other VREF pin grounded

two VREF pins is less than the lesser of

(VCC – 1.5) or +6

(1)

Exceeding the Recommended Operating Conditions for extended periods of time may effect device reliability or cause parametric shifts.

7.4 Thermal Information

LMP8480, LMP8481

THERMAL METRIC(1)

DGK

NCQ

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

185

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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