SC3-

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Vishay Electro-Films

Revision: 05-Apr-13

2

Document Number: 61014

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.050" x 0.050" ± 0.003" (1.27 mm x 1.27 mm ± 0.076 mm)

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Resistor Material

Nichrome

Bonding Pad Size

0.0075" x 0.045" (0.190 mm x 1.143 mm) minimum

Number of Pads

2

Pad Material

15 kÅ minimum gold standard (Al optional)

Backing

None, lapped semiconductor silicon (Au optional)

GLOBAL PART NUMBER INFORMATION

Global Part Number: SC3-12500KKSGNHWS

Global Part Number Description: SC3- 1.25K 10 % 100 ppm/°C Std Au None H WS

MODEL

RESISTANCE

RESISTANCE

MULTILPLIER

CODE

TOL.

CODE

(%)

TCR

(ppm/°C)

TRIM

STYLE

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

SC3-

First 4

digits are

significant

figures of

resistance

B = 0.01

A = 0.1

0 = 1

1 = 10

B = 0.1

C = 0.25

D = 0.5

F = 1.0

G = 2.0

J = 5.0

K = 10.0

E = ± 25

C = ± 50

K = ± 100

E = Edg

S = Std

U = Usr

G = Au

A = Al

G = Au

N = None

H =

Class H

K =

Class K

WS =

Waffle pack

100 min.,

1 mult

0.045

0.050

0.050

0.0075

0.0075

500

K

S

G

N

K

1

HW

-

C3

2

S

S