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RV датащи(PDF) 2 Page - Vishay Siliconix |
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RV датащи(HTML) 2 Page - Vishay Siliconix |
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2 / 5 page ![]() RV www.vishay.com Vishay Sfernice Revision: 21-Jun-14 2 Document Number: 60022 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 POPULAR OPTION AEC-Q200 moisture resistance Option to order: 0058: Specific production process to withstand 85 °C/85 % RH at Pn/10 Notes (1) Test requiring parts to be mounted on PCB will be performed with the requirement that termination alloy will be the same as solder paste alloy. Gold termination will be tested as B termination (2) Rn: Nominal Resistance Pn: Nominal Power (3) Option to order: 0058 DIMENSIONS in millimeters (inches) SERIES/ CASE SIZES AB D/E C Min. Max. Min. Max. Min. Max. Min. Max. RV 0505 1.198 (0.047) 1.502 (0.059) 1.143 (0.045) 1.397 (0.055) 0.250 (0.010) 0.510 (0.020) 0.373 (0.015) 0.627 (0.025) RV 0603 1.368 (0.054) 1.672 (0.066) 0.623 (0.025) 0.877 (0.035) 0.250 (0.010) 0.510 (0.020) 0.373 (0.015) 0.627 (0.025) RV 0805 1.758 (0.069) 2.062 (0.081) 1.143 (0.045) 1.397 (0.055) 0.250 (0.010) 0.510 (0.020) 0.373 (0.015) 0.627 (0.025) RV 1206 2.908 (0.114) 3.212 (0.126) 1.473 (0.058) 1.727 (0.068) 0.250 (0.010) 0.510 (0.020) 0.373 (0.015) 0.627 (0.025) ENVIRONMENTAL TEST TEST CONDITIONS VALUES AND DRIFTS ( R/R ± %) CECC REQUIREMENTS TYPICAL PERFORMANCE Overload 6.25 x rated power / 2 s (or 2 UL) 0.05 % Rn (2) + 0.05 0.01 % Rn (2) Climatic sequences (1) -55 °C / +155 °C 5 moisture cycles 0.1 % Rn (2) + 0.05 0.02 % Rn (2) Thermal shock (1) -55 °C / +155 °C 5 cycles 30 min 0.05 % Rn (2) + 0.05 0.02 % Rn (2) Load life (1) +70 °C/Pn 1000 h 0.1 % Rn (2) + 0.05 0.05 % Rn (2) Resistance to solder heat +260 °C/ 10 s 0.05 % Rn (2) + 0.05 0.02 % Rn (2) Moisture resistance (1) +40 °C / 93 % HR Pn / 10 0.1 % Rn (2) + 0.05 0.01 % Rn (2) AEC-Q200 (3) 85 °C / 85 % RH / Pn / 10 1000 h 0.5 % + 0.05 Max. < 0.3 % + 0.05 High temperature storage 1000 h at + 155 °C 0.1 % Rn (2) + 0.05 0.05 % Rn (2) Bending (1) 10 bends / 2 mm / 5 s 0.05 % Rn (2) + 0.05 0.02 % Rn (2) SPECIFIC CONDITIONS DUE TO TERMINATION TYPE TEST CONDITIONS VALUES AND DRIFTS B; G N VISHAY REQUIREMENTS TYPICAL PERFORMANCE Solderability +235 °C/2 s Sn60Pb40 alloy +245 °C/3 s Sn97Ag3 alloy VISUAL INSPECTION High T° reflow profile N/A +255 °C/40 s (on parts) 0.02 % Rn (2) + 0.05 0.01 % Rn (2) + 0.05 A D D C E E B |
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