SG1844/SG1845 Series

PRODUCT DA T ABOOK 1996/1997

Copyright © 2000

Rev. 1.4

4/00

2

ABSOLUTE MAXIMUM RATINGS

(Notes 1 & 2)

Supply Voltage (I

Supply Voltage (Low Impedance Source) ........................................................ 30V

Output Current (Peak) ....................................................................................... ±1A

Output Current (Continuous) ....................................................................... 350mA

Output Energy (Capacitive Load) ....................................................................... 5µJ

Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V

Error Amp Output Sink Current ..................................................................... 10mA

Operating Junction Temperature

Hermetic (J, Y, F, L Packages) ................................................................... 150°C

Plastic (N, M, D, DM Packages) ................................................................ 150°C

Storage Temperature Range .......................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C

PACKAGE PIN OUTS

V

REF

V

CC

OUT UT

GND

COM

V

FB

I

SENSE

R

1

8

27

36

45

M & Y PACKAGE

(Top View)

DM PACKAGE

(Top View)

V

REF

V

CC

OUT UT

GND

COM

V

FB

I

SENSE

R

1

8

27

36

45

V

REF

N.C.

V

CC

V

C

OUT UT

GND

WR GND

COM

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

1

14

213

312

411

510

69

78

D PACKAGE

(Top View)

M PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

95°C/W

N PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

65°C/W

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

165°C/W

D PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Y PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

130°C/W

J PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

80°C/W

F PACKAGE:

THERMAL RESISTANCE-JUNCTION TO CASE,

θθθθθ

JC

80°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

145°C/W

L PACKAGE:

THERMAL RESISTANCE-JUNCTION TO CASE,

θθθθθ

JC

35°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Junction Temperature Calculation: T

The

θ

system. All of the above assume no ambient airflow.

THERMAL D ATA

Note 1. Exceeding these ratings could cause damage to the device.

Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified

terminal.

1

14

213

312

411

510

69

78

J & N PACKAGE

(Top View)

COM

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

V

REF

N.C.

V

CC

V

C

OUT UT

GROUND

OWER GND

F PACKAGE

(Top View)

10.V

REF

9. V

CC

8. V

C

7. OUT UT

6. GND

1. COM

2. V

FB

3. I

SENSE

4. R

5. OWER GND

1

10

29

38

47

56

L PACKAGE

(Top View)

32

4

5

6

7

8

911

10

1. N.C.

2. N.C.

3. COM .

4. N.C.

5. V

FB

6. N.C.

7. I

SENSE

8. R

9. N.C.

10. N.C.

120 19

18

17

16

15

14

12 13

11. N.C.

12. WR GND

13. GND

14. N.C.

15. OUT UT

16. N.C.

17. V

C

18. V

CC

19. N.C.

20. V

REF