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SG3546DM датащи(PDF) 2 Page - Microsemi Corporation

номер детали SG3546DM
подробное описание детали  3.3 V UNDERVOLTAGE SENSING CIRCUIT
PDF  7 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

SG3546DM датащи(HTML) 2 Page - Microsemi Corporation

  SG3546DM Datasheet HTML 1Page - Microsemi Corporation SG3546DM Datasheet HTML 2Page - Microsemi Corporation SG3546DM Datasheet HTML 3Page - Microsemi Corporation SG3546DM Datasheet HTML 4Page - Microsemi Corporation SG3546DM Datasheet HTML 5Page - Microsemi Corporation SG3546DM Datasheet HTML 6Page - Microsemi Corporation SG3546DM Datasheet HTML 7Page - Microsemi Corporation  
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3.3V U NDER VOL T A G E S ENSING C IRCUIT
SG3546
PRODUCT DA T ABOOK 1996/1997
Copyright © 1994
Rev. 1.3
2/96
2
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Supply Voltage (V
IN) ............................................................................... -1V to 12V
RESET Output Voltage (V
OUT) .......................................................................... -1V to 12V
Clamp Diode Forward Current .............................................................................. 100mA
Operating Junction Temperature
Plastic (DM - Package) ......................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C
PACKAGE PIN OUTS
RESET
INPUT
N.C.
GROUND
N.C.
N.C.
N.C.
N.C.
DM PACKAGE
(Top View)
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
156°C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
THERMAL DATA
BLOCK DIAGRAM
LP PACKAGE
(Top View)
3. GROUND
2. INPUT
1. RESET
1.2 V
REF
INPUT
RESET
GROUND
2
1
4
1
8
2
7
3
6
4
5



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