LX1664/64A, LX1665/65A

PRODUCT DA T ABOOK 1996/1997

Copyright © 1999

Rev. 1.2 11/99

2

Supply Voltage (V

Supply Voltage (V

Output Drive Peak Current Source (500ns) ............................................................... 1.5A

Output Drive Peak Current Sink (500ns) ................................................................... 1.5A

Input Voltage (SS, INV, V

Operating Junction Temperature

Plastic (N, D & DW Packages) ............................................................................. 150°C

Storage Temperature Range .................................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C

PACKAGE PIN OUTS

N (16-PIN DIP) PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

65°C/W

N (18-PIN DIP) PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

60°C/W

D PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

DW PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

90°C/W

Junction Temperature Calculation:

T

The

θ

All of the above assume no ambient airflow

THERMAL DATA

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect

to Ground. Currents are positive into, negative out of the specified terminal. Pin

numbers refer to DIL packages only.

V

C1

TDRV

GND

BDRV

V

CC

C

T

L

DRV

L

FB

SS

INV

V

CC_CORE

VID0

VID1

VID2

VID3

VID4

1

16

215

314

413

512

611

710

89

N PACKAGE — 16-Pin

LX1664/1664A (Top View)

V

C1

TDRV

GND

BDRV

V

CC

C

T

L

DRV

L

FB

SS

INV

V

CC_CORE

VID0

VID1

VID2

VID3

VID4

1

16

215

314

413

512

611

710

89

D PACKAGE — 16-Pin

LX1664/1664A (Top View)

V

C1

TDRV

GND

BDRV

V

CC

C

T

OV

L

DRV

PWRGD

SS

INV

V

CC_CORE

VID0

VID1

VID2

VID3

VID4

L

FB

1

18

217

316

415

514

613

712

811

910

N PACKAGE — 18-Pin

LX1665/1665A (Top View)

V

C1

TDRV

GND

BDRV

V

CC

C

T

OV

L

DRV

PWRGD

SS

INV

V

CC_CORE

VID0

VID1

VID2

VID3

VID4

L

FB

1

18

217

316

415

514

613

712

811

910

DW PACKAGE — 18-Pin

LX1665/1665A (Top View)

DEVICE SELECTION GUIDE

OVP and

Current-Sense

DEVICE

Packages

Power Good

Comp. Thresh. (mV) Optimal Load

LX1664

16-pin SOIC

No

100

Pentium-class (<10A)

LX1664A

& DIP

60

Pentium II (> 10A)

LX1665

18-pin SOIC

Yes

100

Pentium-class (<10A)

LX1665A

& DIP

60

Pentium II (> 10A)

Smallest Package Size. The LX1664 is

available in a narrow body 16-pin surface

mount IC package for space sensitive appli-

cations. The LX1665 provides the additional

functions of Over Voltage Protection (OVP)

and Power Good (PWRGD) output drives

for applications requiring output voltage

monitoring and protection functions.

Ultra-Fast Transient Response re-

duces system cost. The modulated off-

time architecture results in the fastest tran-

sient response for a given inductor, reduc-

ing output capacitor requirements, and re-

ducing the total regulator system cost.

Over-Voltage Protection and Power

Good Flag. The OVP output in the LX1665

& LX1665A can be used to drive an SCR

crowbar circuit to protect the load in the

event of a short-circuit of the main MOSFET.

The LX1665 & LX1665A also have a logic-

level Power Good Flag to signal when the

output voltage is out of specified limits.