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LX1669CD датащи(PDF) 2 Page - Microsemi Corporation |
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LX1669CD датащи(HTML) 2 Page - Microsemi Corporation |
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2 / 14 page ![]() P ROGRAMMABLE DC:DC C ONTROLLER LX1669 PRODUCT DA T ABOOK 1996/1997 Copyright © 1999 Rev. 1.0 4/99 2 P RODUCTION D ATA S HEET 12V Supply Voltage (V CC12) .................................................................................. 18V 5V Supply Voltage (V CC5) ....................................................................................... 7V Output Drive Peak Current Source (500ns) ....................................................... 1.0A Output Drive Peak Current Sink (500ns) ........................................................... 1.0A Input Voltage (SS, VID[0:4]) ................................................................... -0.3V to 6V Operating Junction Temperature .................................................................... 150°C Storage Temperature Range ........................................................... -65°C to +150°C Lead Temperature (Soldering, 10 Seconds) .................................................... 300°C Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. Note 2. V CC3 supply is used as input to internal low dropout regulator. Voltages above 3.3V will cause increased thermal dissipation in the package. Power dissipation should be limited to keep junction temperature below maximum rating. D PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 120°C/W Junction Temperature Calculation: T J = T A + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. THERMAL DATA ABSOLUTE MAXIMUM RATINGS (Note 1 & 2) PACKAGE PIN OUTS 1 16 215 314 413 512 611 710 89 D PACKAGE (Top View) PGND BDRV AGND SS/ENABLE V FB V CORE VID4 VID3 TDRV V CC12 V CC5 PWRGD OVP VID0 VID1 VID2 |
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