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LMZ14203H датащи(PDF) 23 Page - Texas Instruments |
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LMZ14203H датащи(HTML) 23 Page - Texas Instruments |
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23 / 31 page ![]() 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 1 2 3 4 5 OUTPUT CURRENT (A) VIN = 15V VIN = 24V VIN = 30V VIN = 36V VIN = 42V 1 2 3 4 5 6 7 Top View VIN COUT VOUT RENT RON CSS GND Thermal Vias CIN GND RENB CFF RFBT RFBB GND Plane EPAD LMZ14203H www.ti.com SNVS692G – JANUARY 2011 – REVISED OCTOBER 2015 Layout Example (continued) Figure 50. PCB Layout Guide 10.3 Power Dissipation and Board Thermal Requirements For a design case of VIN = 24 V, VOUT = 12 V, IOUT = 3 A, TA (MAX) = 65°C , and TJUNCTION = 125°C, the device must see a maximum junction-to-ambient thermal resistance of: RθJA-MAX < (TJ-MAX - TA(MAX)) / PD (24) This RθJA-MAX will ensure that the junction temperature of the regulator does not exceed TJ-MAX in the particular application ambient temperature. To calculate the required RθJA-MAX we need to get an estimate for the power losses in the IC. The following graph is taken form the Typical Characteristics section (Figure 16) and shows the power dissipation of the LMZ14203H for VOUT = 12 V at 85°C TA. Figure 51. Power Dissipation VOUT = 12V TA = 85°C Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: LMZ14203H |
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