thermally conductive insulator designed

for demanding aerospace and

commercial applications.

formulated to maximize the thermal and

dielectric performance of the filler/binder

matrix. The result is a grease-free,

conformable material capable of meeting

or exceeding the thermal and electrical

requirements of high-reliability electronic

packaging applications.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Power supplies

• Motor controls

• Power semiconductors

• Aerospace

• Avionics

CONFIGURATIONS AVAILABLE

• Sheet form, die-cut parts

• With or without pressure sensitive adhesive

PDS_SP_2000_0415

FEATURES AND BENEFITS

(@50 psi)

• Optimal heat transfer

• High thermal conductivity: 3.5 W/m-K

PRODUCT DESCRIPTION

Higher Performance,

High Reliability Insulator

April 2015

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

White

White

Visual

Reinforcement Carrier

Fiberglass

Fiberglass

—

Thickness (inch) / (mm)

0.010 to 0.020

0.254 to 0.508

ASTM D374

Hardness (Shore A)

90

90

ASTM D2240

Continuous Use Temp (°F) / (°C)

-76 to 392

-60 to 200

—

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

4000

4000

ASTM D149

Dielectric Constant (1000 Hz)

4.0

4.0

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L.94

THERMAL

Thermal Conductivity (W/m-K)

3.5

3.5

ASTM D5470

THERMAL PERFORMANCE vs PRESSURE

Pressure (psi)

10

25

50

100

200

TO-220 Thermal Performance (°C/W) 0.010''

2.61

2.32

2.02

1.65

1.37

0.57

0.43

0.33

0.25

0.20

1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These

values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and

pressure applied.

TYPICAL PROPERTIES OF SIL-PAD 2000