conductive interface material.The material

is a filled, thermally conductive polymer

supplied on a rubber-coated fiberglass

carrier allowing for easy material

handling.The conformable nature of

gaps between PC boards and heat sinks

or a metal chassis.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Telecommunications

• Computer and peripherals

• Power conversion

• Between heat-generating semiconductors or

magnetic components and a heat sink

• Area where heat needs to be transferred to a frame,

chassis, or other type of heat spreader

CONFIGURATIONS AVAILABLE

• Sheet form and die-cut parts

PDS_GP_VO_0711

FEATURES AND BENEFITS

• Thermal conductivity: 0.8 W/m-K

• Enhanced puncture, shear and

tear resistance

• Conformable gap filling material

• Electrically isolating

PRODUCT DESCRIPTION

Conformable,Thermally Conductive

Material for Filling Air Gaps

July 2011

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

Gold/Pink

Gold/Pink

Visual

Reinforcement Carrier

Sil-Pad

Sil-Pad

—

Thickness (inch) / (mm)

0.020 to 0.250

0.508 to 6.350

ASTM D374

Inherent Surface Tack (1 sided)

1

1

—

Density (Bulk Rubber) (g/cc)

1.6

1.6

ASTM D792

Heat Capacity (J/g-K)

1.0

1.0

ASTM E1269

Hardness (BulkRubber) (Shore 00) (1)

40

40

ASTM D2240

Young's Modulus (psi) / (kPa) (2)

100

689

ASTM D575

Continuous Use Temp (°F) / (°C)

-76 to 392

-60 to 200

—

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

>6000

>6000

ASTM D149

Dielectric Constant (1000 Hz)

5.5

5.5

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L. 94

THERMAL

Thermal Conductivity (W/m-K)

0.8

0.8

ASTM D5470

THERMAL PERFORMANCE vs. STRAIN

Deflection (% strain)

10

20

30

2.47

2.37

2.24

1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min.step rate of strain

mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-

face roughness,flatness and pressure applied.

TYPICAL PROPERTIES OF GAP PAD VO

1

3

5

7

9

11

13

250

200

150

100

50

0

Thickness vs. Thermal Resistance

Gap Pad VO