LM2773TLSLASHNOPB datasheet(3/18 Pages) TI

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LM2773

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SNVS554A – JANUARY 2008 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

VIN Pin Voltage

-0.3V to 6.0V

EN, SEL Pin Voltage

-0.3V to (VIN+0.3V) w/ 6.0V max

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

-65°C to +150° C

Maximum Lead Temperature

265°C

(Soldering, 10 sec.)

ESD Rating(5)

Human Body Model:

2.5kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

All voltages are with respect to the potential at the GND pins.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and

disengages at TJ=140°C (typ.).

(5)

The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

Input Voltage Range

2.5V to 5.5V

Recommended Load Current Range

0mA to 300mA

Junction Temperature (TJ) Range

-30°C to +110°C

Ambient Temperature (TA) Range

(3)

-30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 110°C), the

maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal

75°C/W

Resistance (

θJA), DSBGA-9 Package

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues.

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