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PIC16LC620-04/P датащи(PDF) 95 Page - Microchip Technology |
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PIC16LC620-04/P датащи(HTML) 95 Page - Microchip Technology |
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95 / 108 page ![]() © 1998 Microchip Technology Inc. Preliminary DS30235G-page 95 PIC16C62X 14.0 PACKAGING INFORMATION Package Type: K04-010 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil * Controlling Parameter. n 2 1 R MIN Window Length Window Width Overall Row Spacing Radius to Radius Width Package Width Package Length Tip to Seating Plane Base to Seating Plane Top of Lead to Seating Plane Top to Seating Plane Lead Thickness Shoulder Radius Upper Lead Width Lower Lead Width Number of Pins PCB Row Spacing Dimension Limits Pitch Units eB W2 W1 L E E1 D A1 A2 A B c R B1 n p 0.15 7.24 7.87 0.76 3.33 4.83 0.30 0.38 1.52 0.53 2.59 0.200 0.140 0.385 0.270 0.298 0.900 0.138 0.023 0.111 0.183 0.190 0.130 0.345 0.125 0.255 0.285 0.880 0.015 0.091 0.175 0.210 0.150 0.425 0.150 0.285 0.310 0.920 0.030 0.131 0.190 0.010 0.013 0.055 0.019 0.100 0.300 NOM 0.016 0.008 0.010 0.050 0.098 INCHES* MAX 18 0.021 0.012 0.015 0.060 0.102 22.86 0.19 0.13 8.76 6.48 7.24 22.35 3.18 0.00 2.31 4.45 0.2 0.14 9.78 10.80 0.21 3.49 6.86 7.56 0.57 2.82 4.64 3.81 23.37 NOM MILLIMETERS MIN 0.20 0.25 1.27 0.41 2.49 MAX 0.47 0.25 0.32 1.40 2.54 18 7.62 D W2 E W1 c eB E1 p L A1 B B1 A A2 |
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