PIC16C71-04SLASHP datasheet(113/176 Pages) MICROCHIP

113 / 176 page

DS30272A-page 113

PIC16C71X

Applicable Devices

710 71 711 715

13.1

DC Characteristics:

PIC16C715-04 (Commercial, Industrial, Extended)

PIC16C715-10 (Commercial, Industrial, Extended)

PIC16C715-20 (Commercial, Industrial, Extended))

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

0˚C

≤ TA ≤ +70˚C (commercial)

-40˚C

≤ TA ≤ +85˚C (industrial)

-40˚C

≤ TA ≤ +125˚C (extended)

Param.

No.

Characteristic

Sym

Min Typ† Max Units

Conditions

D001

D001A

Supply Voltage

VDD

4.0

4.5

5.5

XT, RC and LP osc conﬁguration

HS osc conﬁguration

D002*

RAM Data Retention

Voltage (Note 1)

VDR

1.5

Device in SLEEP mode

D003

VDD start voltage to

ensure internal Power-

on Reset signal

VPOR

VSS

See section on Power-on Reset for details

D004*

VDD rise rate to ensure

internal Power-on Reset

signal

SVDD

0.05

V/ms See section on Power-on Reset for details

D005

Brown-out Reset Voltage

BVDD

3.7

4.0

4.3

BODEN conﬁguration bit is enabled

D010

D013

Supply Current (Note 2)

IDD

2.7

13.5

XT, RC osc conﬁguration (PIC16C715-04)

FOSC = 4 MHz, VDD = 5.5V (Note 4)

HS osc conﬁguration (PIC16C715-20)

FOSC = 20 MHz, VDD = 5.5V

D015

Brown-out Reset Current

(Note 5)

∆IBOR

300*

500

µA

BOR enabled VDD = 5.0V

D020

D021

D021A

D021B

Power-down Current

(Note 3)

IPD

10.5

1.5

µA

VDD = 4.0V, WDT enabled, -40

°C to +85°C

VDD = 4.0V, WDT disabled, -0

°C to +70°C

VDD = 4.0V, WDT disabled, -40

°C to +85°C

VDD = 4.0V, WDT disabled, -40

°C to +125°C

D023

Brown-out Reset Current

(Note 5)

∆IBOR

300*

500

µA

BOR enabled VDD = 5.0V

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as speciﬁed.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

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