PIC876 datasheet(154/218 Pages) MICROCHIP

154 / 218 page

PIC16F87X

DS30292C-page 152

 2001 Microchip Technology Inc.

15.1

DC Characteristics:

PIC16F873/874/876/877-04 (Commercial, Industrial)

PIC16F873/874/876/877-20 (Commercial, Industrial)

PIC16LF873/874/876/877-04 (Commercial, Industrial)

PIC16LF873/874/876/877-04

(Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

0°C

≤ TA ≤ +70°C for commercial

PIC16F873/874/876/877-04

PIC16F873/874/876/877-20

(Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

0°C

≤ TA ≤ +70°C for commercial

Param

No.

Symbol

Characteristic/

Device

Min

Typ†

Max

Units

Conditions

VDD

Supply Voltage

D001

16LF87X

2.0

—

5.5

LP, XT, RC osc configuration

(DC to 4 MHz)

D001

16F87X

4.0

—

5.5

LP, XT, RC osc configuration

D001A

4.5

5.5

HS osc configuration

VBOR

5.5

BOR enabled, FMAX = 14 MHz(7)

D002

VDR

RAM Data Retention

Voltage(1)

—

1.5

—

D003

VPOR

VDD Start Voltage to

ensure internal Power-on

Reset signal

—

VSS

—

See section on Power-on Reset for

details

D004

SVDD

VDD Rise Rate to ensure

internal Power-on Reset

signal

0.05

——

V/ms

See section on Power-on Reset for

details

D005

VBOR

Brown-out Reset

Voltage

3.7

4.0

4.35

BODEN bit in configuration word

enabled

Legend: Rows with standard voltage device data only are shaded for improved readability.

†

Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance

only, and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading, switching rate, oscillator type, internal code execution pattern and temperature also have an impact

on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20

µA to the specification. This value is from charac-

terization and is for design guidance only. This is not tested.

6: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.

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