PIC16C925T-SSLASHCL datasheet(144/182 Pages) MICROCHIP

144 / 182 page

PIC16C925/926

DS39544A-page 142

Preliminary

 2001 Microchip Technology Inc.

IPD

Power-down Current (Note 3)

D020

PIC16LC925/926

—

0.9

µAVDD = 3.0V

D020

PIC16C925/926

—

1.5

µA

VDD = 4.0V

Module Differential Current (Note 5)

D021

∆IWDT

Watchdog Timer

PIC16LC925/926

—

6.0

µAVDD = 3.0V

D021

Watchdog Timer

PIC16C925/926

—

9.0

µA

VDD = 4.0V

D022

∆ILCDT1

LCD Voltage

Generation with

internal RC osc enabled

PIC16LC925/926

—

µAVDD = 3.0V (Note 7)

D022

LCD Voltage

Generation with

internal RC osc enabled

PIC16C925/926

—

µA

VDD = 4.0V (Note 7)

D022A

∆IBOR

Brown-out Reset

—

100

150

µA

BODEN bit set, VDD = 5.0

D024

∆ILCDT1

LCD Voltage

Generation with

Timer1 @ 32.768 kHz

PIC16LC925/926

—

µAVDD = 3.0V (Note 7)

D024

LCD Voltage

Generation with

Timer1 @ 32.768 kHz

PIC16C925/926

—

µA

VDD = 4.0V (Note 7)

15.1

DC Characteristics

(Continued)

PIC16LC925/926

(Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

0°C

≤ TA ≤ +70°C for commercial

PIC16C925/926

(Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

0°C

≤ TA ≤ +70°C for commercial

Param

No.

Sym

Characteristic

Min

Typ† Max Units

Conditions

†

Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin load-

ing and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on

the current consumption.The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail;

all I/O pins tri-stated, pulled to VDD

MCLR = VDD.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.

5: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

6: PWRT must be enabled for slow ramps.

∆ΙLCDT1 and ∆ΙLCDRC includes the current consumed by the LCD Module and the voltage generation

circuitry. This does not include current dissipated by the LCD panel.

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