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LP3893 датащи(PDF) 9 Page - Texas Instruments |
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LP3893 датащи(HTML) 9 Page - Texas Instruments |
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9 / 16 page ![]() LP3893 www.ti.com SNVS237B – SEPTEMBER 2003 – REVISED APRIL 2013 Figure 22. θJA vs Copper (1 Ounce) Area for DDPAK/TO-263 Package As shown in the graph below, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. Figure 23 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C. Figure 23. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LP3893 |
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